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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Zhang, Guoqi
Delft University of Technology
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (20/20 displayed)
- 2024Training Convolutional Neural Networks with Confocal Scanning Acoustic Microscopy Imaging for Power QFN Package Delamination Classification
- 2023Heterogeneous Integration of Diamond Heat Spreaders for Power Electronics Applicationcitations
- 2022Patterning of fine-features in nanoporous films synthesized by spark ablationcitations
- 2021Facile synthesis of ag nanowire/tio2 and ag nanowire/tio2/go nanocomposites for photocatalytic degradation of rhodamine bcitations
- 2020Vertically-Aligned Multi-Walled Carbon Nano Tube Pillars with Various Diameters under Compressioncitations
- 2020Toward a Self-Sensing Piezoresistive Pressure Sensor for all-SiC Monolithic Integrationcitations
- 2018Effects of Conformal Nanoscale Coatings on Thermal Performance of Vertically Aligned Carbon Nanotubescitations
- 2018Wafer Level Through Polymer Optical Vias (TPOV) Enabling High Throughput of Optical Windows Manufacturing
- 20163D interconnect technology based on low temperature copper nanoparticle sinteringcitations
- 2015An overview of scanning acoustic microscope, a reliable method for non-destructive failure analysis of microelectronic componentscitations
- 2010Theory of aluminum metallization corrosion in microelectronics
- 2009Reliability of Wafer Level Thin Film MEMS Packages during Wafer Backgrinding
- 2008Effect of aging of packaging materials on die surface cracking of a SiP carrier
- 2008Die Fracture Probability Prediction and Design Guidelines for Laminate-Based Over-Molded Packages
- 2007Modeling of the mechanical stiffness of the GaP/GaAs nanowires with point defects/stacking faults
- 2007Correlation between chemistry of polymer building blocks and microelectronics reliability
- 2007Effect of filler concentration of rubbery shear and bulk modulus of molding compounds
- 2007Micro-mechanical testing of SiLK by nanoindentation and substrate curvature techniques
- 2007Characterization of moisture properties of polymers for IC packaging
- 2005State-of-the-Art of Thermo-Mechanical Characterization of Thin Polymer Films
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document
Heterogeneous Integration of Diamond Heat Spreaders for Power Electronics Application
Abstract
<p>Integrated Circuits and Electronic Modules experience concentrated thermal hot spots, which require advanced thermal solutions for effective distribution and dissipation of heat. The superior thermal properties of diamonds are long known, and it is an ideal material for heat-spreading applications. However, growing diamond films to the electronic substrate require complex processing at high temperatures. This research investigates a heterogeneous method of integrating diamond heat spreaders during the back-end packaging process. The semiconductor substrate and the heat spreader thicknesses were optimized based on simulations to realize a thermally enhanced Power Quad-Flat No-Lead package. The performance of the thermally enhanced PQFN was assessed by monitoring the temperature distribution across the active device surface and compared to a standard PQFN (without a heat spreader). Firstly, the thermally enhanced PQFN indicated a 9.6% reduction in junction temperature for an input power of 6.6W with a reduced thermal gradient on the active device surface. Furthermore, the diamond heat spreader's efficiency was observed to increase with increasing power input. Besides, the reliability of the thermally enhanced PQFN was tested by thermal cycling from -55°C to 150°C, which resulted in less than 2% thermal degradation over two-hundred cycles. Such choreographed thermal solutions are proven to enhance the packaged device's performance, and the superior thermal properties of the diamond are beneficial to suffice the increasing demand for high power. </p>