Materials Map

Discover the materials research landscape. Find experts, partners, networks.

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The Materials Map is an open tool for improving networking and interdisciplinary exchange within materials research. It enables cross-database search for cooperation and network partners and discovering of the research landscape.

The dashboard provides detailed information about the selected scientist, e.g. publications. The dashboard can be filtered and shows the relationship to co-authors in different diagrams. In addition, a link is provided to find contact information.

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Materials Map under construction

The Materials Map is still under development. In its current state, it is only based on one single data source and, thus, incomplete and contains duplicates. We are working on incorporating new open data sources like ORCID to improve the quality and the timeliness of our data. We will update Materials Map as soon as possible and kindly ask for your patience.

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1.080 Topics available

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977 Locations available

693.932 PEOPLE
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Naji, M.
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in Cooperation with on an Cooperation-Score of 37%

Topics

Publications (20/20 displayed)

  • 2024Training Convolutional Neural Networks with Confocal Scanning Acoustic Microscopy Imaging for Power QFN Package Delamination Classificationcitations
  • 2023Heterogeneous Integration of Diamond Heat Spreaders for Power Electronics Application5citations
  • 2022Interphase effect on the effective moisture diffusion in epoxy–SiO2 composites5citations
  • 2021Facile synthesis of ag nanowire/tio2 and ag nanowire/tio2/go nanocomposites for photocatalytic degradation of rhodamine b23citations
  • 2021Exploring water and ion transport process at silicone/copper interfaces using in-situ electrochemical and Kelvin probe approaches4citations
  • 2018Solid State Lighting Reliability Part 2citations
  • 2016Creep fatigue models of solder joints59citations
  • 2015An overview of scanning acoustic microscope, a reliable method for non-destructive failure analysis of microelectronic components39citations
  • 2010Designing for reliability using a new Wafer Level Package structurecitations
  • 2009Virtual Prototyping for PPM-level Failures in Microelectronic Packagescitations
  • 2009Reliability of Wafer Level Thin Film MEMS Packages during Wafer Backgrindingcitations
  • 2008Effect of aging of packaging materials on die surface cracking of a SiP carriercitations
  • 2008Die Fracture Probability Prediction and Design Guidelines for Laminate-Based Over-Molded Packagescitations
  • 2007Modeling of the mechanical stiffness of the GaP/GaAs nanowires with point defects/stacking faultscitations
  • 2007Efficient damage sensitivity analysis of advanced Cu/low-k bond pad structures by means of the area release energy criterioncitations
  • 2007Correlation between chemistry of polymer building blocks and microelectronics reliabilitycitations
  • 2007Measuring the through-plane elastic modulus of thin polymer films in situcitations
  • 2007Characterization of moisture properties of polymers for IC packagingcitations
  • 2006Mixed Mode Bending Test for Interfacial Adhesion in Semiconductor Applicationscitations
  • 2005The precision of large radio continuum source catalogues. An application of the SPECFIND tool15citations

Places of action

Chart of shared publication
Zhang, Guoqi
10 / 20 shared
Smits, Edsger C. P.
1 / 3 shared
Martin, Henry Antony
2 / 2 shared
Xu, Haojia
1 / 1 shared
Dorrestein, Sander
1 / 1 shared
Reijs, Dave
1 / 1 shared
Libon, Sebastien
1 / 1 shared
Kengen, Martien
1 / 1 shared
Reintjes, Marcia
1 / 1 shared
Tang, Xiao
1 / 1 shared
Poelma, R. H.
1 / 11 shared
Smits, Edsger
1 / 1 shared
Koelink, Marco
1 / 1 shared
Soestbergen, M. Van
2 / 3 shared
Herrmann, A.
1 / 13 shared
Buyl, F. De
2 / 2 shared
Mol, Arjan
2 / 64 shared
Erich, S. J. F.
2 / 7 shared
Mavinkurve, A.
2 / 5 shared
Ven, L. G. J. Van Der
2 / 2 shared
Adan, O. C. G.
2 / 9 shared
Fischer, H. R.
1 / 30 shared
Huinink, H. P.
1 / 9 shared
Bahrami, Abbas
1 / 17 shared
Yazdan Mehr, Maryam
2 / 2 shared
Hajipour, Pejman
1 / 3 shared
Munirathinam, Balakrishnan
1 / 3 shared
Herrmann, Annemarie
1 / 3 shared
Van Dam, Joost
1 / 3 shared
Wong, E. H.
1 / 1 shared
Dasgupta, A.
1 / 10 shared
Pecht, M.
1 / 1 shared
Fischer, H.
1 / 27 shared
Bahrami, A.
1 / 3 shared
Corbeij, R.
1 / 1 shared
Gielen, S.
1 / 1 shared
Bagerman, E.
1 / 1 shared
Zaal, Jjm
2 / 2 shared
Hochstenbach, Ph
1 / 1 shared
Yang, D.
2 / 10 shared
Engelen, Rab
2 / 2 shared
Cobussen, H.
1 / 1 shared
Dort, M. Van
1 / 1 shared
Eckendonk, M. Van
1 / 1 shared
Endrinal, L.
1 / 1 shared
Verheijden, Gjam
1 / 1 shared
Gautier, C.
1 / 3 shared
Ma, X.
2 / 15 shared
Sluis, O. Van Der
4 / 9 shared
Jansen, Kaspar
4 / 48 shared
Regard, C.
1 / 3 shared
Frémont, H.
1 / 2 shared
Ernst, Lj
4 / 26 shared
Theunis, F.
1 / 1 shared
Bielen, Ja
1 / 1 shared
Bakkers, Epam
1 / 1 shared
Yuan, Ca
1 / 1 shared
Dawotola, Aw
1 / 1 shared
Silfhout, Rbr Van
1 / 2 shared
Gils, Maj Van
2 / 2 shared
Bressers, Hjl
1 / 3 shared
Thijsse, J.
1 / 3 shared
Vollmer, Bernd
1 / 1 shared
Ochsenbein, François
1 / 1 shared
Dubois, Pascal
1 / 1 shared
Genova, Françoise
1 / 1 shared
Davoust, Emmanuel
1 / 1 shared
Chart of publication period
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Co-Authors (by relevance)

  • Zhang, Guoqi
  • Smits, Edsger C. P.
  • Martin, Henry Antony
  • Xu, Haojia
  • Dorrestein, Sander
  • Reijs, Dave
  • Libon, Sebastien
  • Kengen, Martien
  • Reintjes, Marcia
  • Tang, Xiao
  • Poelma, R. H.
  • Smits, Edsger
  • Koelink, Marco
  • Soestbergen, M. Van
  • Herrmann, A.
  • Buyl, F. De
  • Mol, Arjan
  • Erich, S. J. F.
  • Mavinkurve, A.
  • Ven, L. G. J. Van Der
  • Adan, O. C. G.
  • Fischer, H. R.
  • Huinink, H. P.
  • Bahrami, Abbas
  • Yazdan Mehr, Maryam
  • Hajipour, Pejman
  • Munirathinam, Balakrishnan
  • Herrmann, Annemarie
  • Van Dam, Joost
  • Wong, E. H.
  • Dasgupta, A.
  • Pecht, M.
  • Fischer, H.
  • Bahrami, A.
  • Corbeij, R.
  • Gielen, S.
  • Bagerman, E.
  • Zaal, Jjm
  • Hochstenbach, Ph
  • Yang, D.
  • Engelen, Rab
  • Cobussen, H.
  • Dort, M. Van
  • Eckendonk, M. Van
  • Endrinal, L.
  • Verheijden, Gjam
  • Gautier, C.
  • Ma, X.
  • Sluis, O. Van Der
  • Jansen, Kaspar
  • Regard, C.
  • Frémont, H.
  • Ernst, Lj
  • Theunis, F.
  • Bielen, Ja
  • Bakkers, Epam
  • Yuan, Ca
  • Dawotola, Aw
  • Silfhout, Rbr Van
  • Gils, Maj Van
  • Bressers, Hjl
  • Thijsse, J.
  • Vollmer, Bernd
  • Ochsenbein, François
  • Dubois, Pascal
  • Genova, Françoise
  • Davoust, Emmanuel
OrganizationsLocationPeople

document

Heterogeneous Integration of Diamond Heat Spreaders for Power Electronics Application

  • Dorrestein, Sander
  • Reijs, Dave
  • Libon, Sebastien
  • Kengen, Martien
  • Reintjes, Marcia
  • Zhang, Guoqi
  • Martin, Henry Antony
  • Van Driel, Willem
  • Tang, Xiao
  • Poelma, R. H.
  • Smits, Edsger
  • Koelink, Marco
Abstract

<p>Integrated Circuits and Electronic Modules experience concentrated thermal hot spots, which require advanced thermal solutions for effective distribution and dissipation of heat. The superior thermal properties of diamonds are long known, and it is an ideal material for heat-spreading applications. However, growing diamond films to the electronic substrate require complex processing at high temperatures. This research investigates a heterogeneous method of integrating diamond heat spreaders during the back-end packaging process. The semiconductor substrate and the heat spreader thicknesses were optimized based on simulations to realize a thermally enhanced Power Quad-Flat No-Lead package. The performance of the thermally enhanced PQFN was assessed by monitoring the temperature distribution across the active device surface and compared to a standard PQFN (without a heat spreader). Firstly, the thermally enhanced PQFN indicated a 9.6% reduction in junction temperature for an input power of 6.6W with a reduced thermal gradient on the active device surface. Furthermore, the diamond heat spreader's efficiency was observed to increase with increasing power input. Besides, the reliability of the thermally enhanced PQFN was tested by thermal cycling from -55°C to 150°C, which resulted in less than 2% thermal degradation over two-hundred cycles. Such choreographed thermal solutions are proven to enhance the packaged device's performance, and the superior thermal properties of the diamond are beneficial to suffice the increasing demand for high power. </p>

Topics
  • impedance spectroscopy
  • surface
  • simulation
  • semiconductor
  • laser emission spectroscopy