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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Dalverny, Olivier
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Topics
Publications (22/22 displayed)
- 2023Anand model calibration for SAC305 solder joints based on the evolution of the shear stress and strain hysteresis loops for different thermal cycling conditionscitations
- 2022In Situ Ageing with the Platform Preheating of AlSi10Mg Alloy Manufactured by Laser Powder-Bed Fusion Processcitations
- 2019Experimental SAC305 shear stress-strain hysteresis loop construction using Hall's one-dimensional model based on strain gages measurementscitations
- 2019Analysis of the multilayer woven fabric behaviour during the forming process: focus on the loss of cohesion within the woven fibre network
- 2018Microstructural evolutions of Sn-3.0Ag-0.5Cu solder joints during thermal cyclingcitations
- 2018Microstructural evolutions of Sn-3.0Ag-0.5Cu solder joints during thermal cyclingcitations
- 2018Sensitivity analysis of composite forming process parameters using numerical hybrid discrete approach
- 2018Experimental strain energy density dissipated in SAC305 solder joints during different thermal cycling conditions using strain gages measurementscitations
- 2018Experimental strain energy density dissipated in SAC305 solder joints during different thermal cycling conditions using strain gages measurementscitations
- 2017An algorithm for damage detection and localization Usibg output-only response for civil engineering structures subjected to seismic excitations
- 2017An algorithm for damage detection and localization using output-only response for civil-engineering structures subjected to seismic excitation
- 2017Analysis of the multilayer woven fabric behaviour during the forming process. Focus on the loss of cohesion within the woven fibre network.
- 2017Analysis of the multilayer woven fabric behaviour during the forming process. Focus on the loss of cohesion within the woven fibre network
- 2016Experimental study of 48600 Carbons fabrics behavior using marks tracking technique method
- 2015Experimental characterization of the mechanical behavior of two solder alloys for high temperature power electronics applicationscitations
- 2015Experimental and Numerical Study of Interfacial Fracture Parameters of a Brazed Joints
- 2012Identification of orthotropic material properties using displacement field measurements
- 2012Non destructive investigation of defects in composite structures by three infrared thermographic techniques
- 2012Micromechanical modeling of brittle damage in composite materials: primary anisotropy, induced anisotropy and opening-closure effects
- 2008Modélisation des assemblages de ballons pressurisés stratosphériques
- 20042D and 3D numerical models of metal cutting with damage effectscitations
- 2002Transient Numerical Models of Metal Cutting using the Johnson-Cook's Rupture Criterion.citations
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document
Experimental strain energy density dissipated in SAC305 solder joints during different thermal cycling conditions using strain gages measurements
Abstract
Despite being widely investigated for the last two decades, solder joints thermomechanical durability assessment remains a major concern for industries wishing to switch from lead-based (SnPb) to lead-free electronics. Amongst the variety of lead-free solder compositions, 96.5Sn-3.0Ag-0.5Cu (SAC305) solder alloy has become the preferred substitute to classic SnPb solders. However, unlike SnPb assemblies, the return on experience is limited and the microstructure is very different for SAC305 solder joints. The use of SAC305 solder paste requires to understand the mechanical and fatigue behaviors of the soldered interconnects. This paper presents the experimentation based on strain gages measurements, allowing the determination of the shear stress-strain response of SAC305 solder joints subjected to different thermal cycling conditions. The area of the experimental shear strain-stress hysteresis loops gives the values of the strain energy density corresponding to each thermomechanical loading. The finite element modeling of the test assembly showed a good correlation between experimental and numerical strain energy densities. The experimental shear strain-stress curves also provide the necessary data to derive SAC305 solder joints constitutive laws.