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Naji, M. |
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Motta, Antonella |
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Aletan, Dirar |
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Mohamed, Tarek |
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Ertürk, Emre |
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Taccardi, Nicola |
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Kononenko, Denys |
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Petrov, R. H. | Madrid |
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Alshaaer, Mazen | Brussels |
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Bih, L. |
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Casati, R. |
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Muller, Hermance |
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Kočí, Jan | Prague |
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Šuljagić, Marija |
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Kalteremidou, Kalliopi-Artemi | Brussels |
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Azam, Siraj |
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Ospanova, Alyiya |
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Blanpain, Bart |
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Ali, M. A. |
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Popa, V. |
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Rančić, M. |
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Ollier, Nadège |
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Azevedo, Nuno Monteiro |
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Landes, Michael |
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Rignanese, Gian-Marco |
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Kiihamäki, Jyrki
VTT Technical Research Centre of Finland
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (8/8 displayed)
- 2013Micromechanical resonator array and method for manufacturing thereof
- 2010Low-Temperature Processes for MEMS Device Fabricationcitations
- 2009Etching of Sacrificial CVD Silicon Dioxide with Anhydrous HF Vaporcitations
- 2005Fabrication of SOI micromechanical devices
- 2005Fabrication of SOI micromechanical devices:Dissertation
- 2004Electrical and mechanical properties of micromachined vacuum cavitiescitations
- 2003"Plug-up" - A new concept for fabricating SOI MEMS devicescitations
- 2000Deceleration of silicon etch rate at high aspect ratioscitations
Places of action
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document
"Plug-up" - A new concept for fabricating SOI MEMS devices
Abstract
This paper reports a novel process sequence for making micromechanical devices on silicon on insulator (SOI) wafers. The merits of the new process are its improved immunity to stiction and elimination of conductor metal endurance problems during sacrificial etching with hydrofluoric acid (HF). With this new process one can fabricate vacuum cavities on blank SOI substrates. Further processing of these cavity wafers enables the realization of a wide variety of single crystal micromechanical devices.