Materials Map

Discover the materials research landscape. Find experts, partners, networks.

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The Materials Map is an open tool for improving networking and interdisciplinary exchange within materials research. It enables cross-database search for cooperation and network partners and discovering of the research landscape.

The dashboard provides detailed information about the selected scientist, e.g. publications. The dashboard can be filtered and shows the relationship to co-authors in different diagrams. In addition, a link is provided to find contact information.

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Materials Map under construction

The Materials Map is still under development. In its current state, it is only based on one single data source and, thus, incomplete and contains duplicates. We are working on incorporating new open data sources like ORCID to improve the quality and the timeliness of our data. We will update Materials Map as soon as possible and kindly ask for your patience.

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693.932 PEOPLE
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Technical University of Denmark

in Cooperation with on an Cooperation-Score of 37%

Topics

Publications (6/6 displayed)

  • 2018Ultra-Wideband Coplanar Waveguide to Asymmetric Coplanar Stripline Transition from DC to 165 GHz5citations
  • 2017Coplanar transitions based on aluminum nitride interposer substrate for terabit transceivers4citations
  • 2017Coplanar transitions based on aluminum nitride interposer substrate for terabit transceivers4citations
  • 2012Study of split-ring resonators for use on a pharmaceutical drug capsule for microwave activated drug releasecitations
  • 2011Microwave absorption properties of gold nanoparticle doped polymers8citations
  • 2007Optimization of Packaging for PIN Photodiode Modules for 100Gbit/s Ethernet Applications4citations

Places of action

Chart of shared publication
Zhurbenko, Vitaliy
3 / 6 shared
Dong, Yunfeng
3 / 4 shared
Hanberg, Peter Jesper
1 / 1 shared
Hanberg, Jesper
1 / 2 shared
Jónasson, Sævar Þór
1 / 1 shared
Jensen, Brian Sveistrup
1 / 1 shared
Boisen, Anja
1 / 62 shared
Jakobsen, Mogens Havsteen
1 / 8 shared
Jiang, Chenhui
2 / 2 shared
Curri, M. L.
1 / 17 shared
Ouattara, Lassana
1 / 4 shared
Ingrosso, Chiara
1 / 9 shared
Krozer, V.
1 / 5 shared
Mekonnen, G. G.
1 / 1 shared
Krozer, Viktor
1 / 6 shared
Bach, H-G.
1 / 1 shared
Chart of publication period
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2017
2012
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Co-Authors (by relevance)

  • Zhurbenko, Vitaliy
  • Dong, Yunfeng
  • Hanberg, Peter Jesper
  • Hanberg, Jesper
  • Jónasson, Sævar Þór
  • Jensen, Brian Sveistrup
  • Boisen, Anja
  • Jakobsen, Mogens Havsteen
  • Jiang, Chenhui
  • Curri, M. L.
  • Ouattara, Lassana
  • Ingrosso, Chiara
  • Krozer, V.
  • Mekonnen, G. G.
  • Krozer, Viktor
  • Bach, H-G.
OrganizationsLocationPeople

document

Optimization of Packaging for PIN Photodiode Modules for 100Gbit/s Ethernet Applications

  • Mekonnen, G. G.
  • Johansen, Tom Keinicke
  • Krozer, Viktor
  • Jiang, Chenhui
  • Bach, H-G.
Abstract

In this paper the packaging of optical components is investigated employing a conductor backed coplanar waveguide (CBCPW). The study is performed using 3D electromagnetic (EM) simulations in a broadband range up to 110GHz. Higher-order resonances are observed in both measurement and simulation results. Based on the verified EM simulation setup, the origin of resonances is identified and remedies are suggested in the paper. Several optimization schemes for achieving good transmission characteristics for the planar structure as well as for the coax-CPW transition are proposed such as properly coating side metallization on the CPW, substrate spacing to the metal housing, and developing metal posts in the substrate of the CPW.

Topics
  • impedance spectroscopy
  • simulation