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Naji, M. |
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Motta, Antonella |
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Aletan, Dirar |
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Mohamed, Tarek |
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Ertürk, Emre |
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Taccardi, Nicola |
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Kononenko, Denys |
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Petrov, R. H. | Madrid |
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Alshaaer, Mazen | Brussels |
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Bih, L. |
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Casati, R. |
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Muller, Hermance |
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Kočí, Jan | Prague |
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Šuljagić, Marija |
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Kalteremidou, Kalliopi-Artemi | Brussels |
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Azam, Siraj |
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Ospanova, Alyiya |
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Blanpain, Bart |
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Ali, M. A. |
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Popa, V. |
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Rančić, M. |
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Ollier, Nadège |
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Azevedo, Nuno Monteiro |
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Landes, Michael |
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Rignanese, Gian-Marco |
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Munk-Nielsen, Stig
Aalborg University
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (20/20 displayed)
- 2024Thermal cycling characterization of an integrated low-inductance GaN eHEMT power module
- 2024Thermal cycling characterization of an integrated low-inductance GaN eHEMT power module
- 2023Thermal Characteristics of Liquid Metal Interconnects for Power Semiconductorscitations
- 2023Thermal Characteristics of Liquid Metal Interconnects for Power Semiconductorscitations
- 2021Performance evaluation of lithium-ion batteries (LiFePO 4 cathode) from novel perspectives using a new figure of merit, temperature distribution analysis, and cell package analysiscitations
- 2021Performance evaluation of lithium-ion batteries (LiFePO4 cathode) from novel perspectives using a new figure of merit, temperature distribution analysis, and cell package analysiscitations
- 2020Parametric transformer using PM-inductors with saturation-gapcitations
- 2018Frequency domain scanning acoustic microscopy for power electronics:Physics-based feature identification and selectivitycitations
- 2018Frequency domain scanning acoustic microscopy for power electronicscitations
- 2017Short-Circuit Degradation of 10-kV 10-A SiC MOSFETcitations
- 2015Ageing monitoring in IGBT module under sinusoidal loadingcitations
- 2014A tapped-inductor buck-boost converter for a multi-DEAP generator energy harvesting systemcitations
- 2014A tapped-inductor buck-boost converter for a multi-DEAP generator energy harvesting systemcitations
- 2014A Tapped-Inductor Buck-Boost Converter for a Dielectric ElectroActive Polymer Generatorcitations
- 2014A Tapped-Inductor Buck-Boost Converter for a Dielectric ElectroActive Polymer Generatorcitations
- 2013An electromechanical model for a dielectric electroactive polymer generatorcitations
- 2013An Electromechanical Model of a Dielectric ElectroActive Polymer Generatorcitations
- 2013An Electromechanical Model of a Dielectric ElectroActive Polymer Generatorcitations
- 2012Energy Harvesting Cycles of Dielectric ElectroActive Polymer Generatorscitations
- 2012Energy Harvesting Cycles of Dielectric ElectroActive Polymer Generatorscitations
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document
Thermal Characteristics of Liquid Metal Interconnects for Power Semiconductors
Abstract
<p>Due to its electrical conductivity and fluidity, liquid metal interconnection has the potential to become a new industrial power semiconductors packaging application method to solve the failure of wire bonding liftoff and improve the reliability of power semiconductor applications. As a crucial characteristic in use, the thermal characteristics of liquid metal interconnects for power semiconductors are obtained experimentally in this paper. By powering a diode die in a bridge busbar liquid metal interconnect structure, the thermal resistance from the die to the ambient is extracted. The result shows that the liquid metal interconnects method has the potential to improve the thermal behavior of power semiconductors compared with wire-bonding interconnection. The finite element simulation explains the possible reasons causing abnormal temperature responses among some samples. Besides, during the test, a slow decline in the forward voltage of the module is observed.</p>