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Schulpen, Robbert
Eindhoven University of Technology
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document
Package Thickness Investigation of the U-Slot Patch Antenna for Beyond-5G Antenna-in-Package Applications
Abstract
<p>The U-slot patch antenna is explored as broadband antenna solution for a multi-layer interconnect antenna-in-package (AiP) technology for beyond-5G and 6G phased array applications. An initial design method is used to investigate the bandwidth response of the U-slot patch antenna for different package thicknesses. Simulation results show that a bandwidth larger than 30% can be achieved for package thicknesses between 0.06λ0 and 0.10λ0 with relative permittivity of 2.81 at a center frequency of 28 GHz. A decreased package thickness below 0.06λ0 and restrictions on the line spacing of the package technology results in decreased bandwidth due to the increase of the Q-factor of the antenna and a smaller separation of the resonance peaks.</p>