| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Jones, Thomas David Arthur
University of Dundee
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (13/13 displayed)
- 2024Demonstration of a high-performance continuous casting process for cobalt alloy ASTM F75
- 2022Inkjet printing of high-concentration particle-free platinum inkscitations
- 2021Phase Field & Monte Carlo Potts Simulation of Grain Growth and Morphology of Vertically Upwards Cast Oxygen Free Copper
- 2021Optimising Computational Fluid Dynamic Conditions for Simulating Copper Vertical Castingcitations
- 2020Analysis of throwing power for megasonic assisted electrodeposition of copper inside THVscitations
- 2019A rapid technique for the direct metallization of PDMS substrates for flexible and stretchable electronics applicationscitations
- 2019Selective Electroless Copper Deposition by Using Photolithographic Polymer/Ag Nanocompositecitations
- 2019Selective metallisation of 3D printable thermoplastic polyurethanescitations
- 2018Copper electroplating of PCB interconnects using megasonic acoustic streamingcitations
- 2018A Rapid Photopatterning Method for Selective Plating of 2D and 3D Microcircuitry on Polyetherimidecitations
- 2018Hybrid Additive Manufacture of Conformal Antennascitations
- 2017Enhanced electrodeposition for the filling of micro-vias
- 2016Megasound Acoustic Surface Treatment Process in the Printed Circuit Board Industrycitations
Places of action
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article
Selective metallisation of 3D printable thermoplastic polyurethanes
Abstract
This article presents a selective metallization method for the newly developed 3D printable thermoplastic polyurethane elastomers (TPU): FilaFlex®, SemiFlex™, PolyFlex™ and NinjaFlex®. Silver nanoparticles were fabricated in-situ by photo reduction on the surface of TPUs and acted as catalysts for copper ion adsorption. This method demonstrates the successful fabrication of copper patterns on flexible TPU filaments. Furthermore, Polyflex™ and acrylonitrile butadiene styrene (ABS) filaments printed in the same part have been used to enable selective electroless plating directly on Polyflex™ material. Electroless copper deposited onto Polyflex™ has a sheet resistance of (139.4 ± 7.2) mΩ/☐ and a copper conductivity of (1.1 ± 0.1) × 107 S/m that is comparable to bulk copper. Copper-plated Polyflex™ interconnects were fabricated as a proof of concept demonstrators.