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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Teixeira, S.
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (13/13 displayed)
- 2021NUMERICAL SIMULATION OF SOLDER PASTE PRINTING ON THROUGH-HOLE COMPONENTS
- 2021Experimental measurements of the shear force on surface mount components simulating the wave soldering processcitations
- 2020Influence of Operating Conditions on the Thermal Behavior and Kinetics of Pine Wood Particles Using Thermogravimetric Analysiscitations
- 2018Effect of the Soldering Atmosphere on the Wettability Between Sn4.0Ag0.5Cu (in wt.%) Lead-Free Solder Paste and Various Substratescitations
- 2017Photocatalytic degradation of recalcitrant micropollutants by reusable Fe<inf>3</inf>O<inf>4</inf>/SiO<inf>2</inf>/TiO<inf>2</inf> particlescitations
- 2016Influence of Copper Layer Content in the Elastic and Damping Behavior of Glass-Fiber/Epoxy-Resin Compositescitations
- 2016TiO<inf>2</inf>/graphene oxide immobilized in P(VDF-TrFE) electrospun membranes with enhanced visible-light-induced photocatalytic performancecitations
- 2016Reusability of photocatalytic TiO <inf>2</inf> and ZnO nanoparticles immobilized in poly(vinylidene difluoride)-co-trifluoroethylenecitations
- 2016Ciprofloxacin wastewater treated by UVA photocatalysis: Contribution of irradiated TiO<inf>2</inf> and ZnO nanoparticles on the final toxicity as assessed by Vibrio fischericitations
- 2015Wetting behaviour of SAC305 solder on different substrates in high vacuum and inert atmospherecitations
- 2010In vivo evaluation of highly macroporous ceramic scaffolds for bone tissue engineeringcitations
- 2004Production of porus hydroxyapatite with potential for controlled drug delivery
- 2004Porous hydroxyapatite and glass reinforced hydroxyapatite for controlled release of sodium ampicillin
Places of action
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article
Experimental measurements of the shear force on surface mount components simulating the wave soldering process
Abstract
Purpose - This study aims to determine the minimum force required to pull out a surface mount component in printed circuit boards (PCBs) during the wave soldering process through both experimental and numerical procedures. Design/methodology/approach - An efficient experimental technique was proposed to determine the minimum force required to pull out a surface mount component in PCBs during the wave soldering process. Findings - The results showed that the pullout force is approximately 0.4 N. Comparing this value with the simulated force exerted by the solder wave on the component (approximately equal to 0.001158 N), it can be concluded that the solder wave does not exert sufficient force to remove a component. Originality/value - This study provides a deep understanding of the wave soldering process regarding the component pullout, a critical issue that usually occurs in the microelectronics industry during this soldering process. By applying both accurate experimental and numerical approaches, this study showed that more tests are needed to evaluate the main cause of this problem, as well as new insights were provided into the depositing process of glue dots on PCBs.