| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Carvalho, V.
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Topics
Publications (5/5 displayed)
- 2022Numerical Modeling of the Wave Soldering Process and Experimental Validationcitations
- 2021NUMERICAL SIMULATION OF SOLDER PASTE PRINTING ON THROUGH-HOLE COMPONENTS
- 2021Experimental measurements of the shear force on surface mount components simulating the wave soldering processcitations
- 2021Prediction of Solder Joint Reliability with Applied Acrylic Conformal Coatingcitations
- 20203D Printed Biomodels for Flow Visualization in Stenotic Vessels: An Experimental and Numerical Studycitations
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article
Experimental measurements of the shear force on surface mount components simulating the wave soldering process
Abstract
Purpose - This study aims to determine the minimum force required to pull out a surface mount component in printed circuit boards (PCBs) during the wave soldering process through both experimental and numerical procedures. Design/methodology/approach - An efficient experimental technique was proposed to determine the minimum force required to pull out a surface mount component in PCBs during the wave soldering process. Findings - The results showed that the pullout force is approximately 0.4 N. Comparing this value with the simulated force exerted by the solder wave on the component (approximately equal to 0.001158 N), it can be concluded that the solder wave does not exert sufficient force to remove a component. Originality/value - This study provides a deep understanding of the wave soldering process regarding the component pullout, a critical issue that usually occurs in the microelectronics industry during this soldering process. By applying both accurate experimental and numerical approaches, this study showed that more tests are needed to evaluate the main cause of this problem, as well as new insights were provided into the depositing process of glue dots on PCBs.