Materials Map

Discover the materials research landscape. Find experts, partners, networks.

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The Materials Map is an open tool for improving networking and interdisciplinary exchange within materials research. It enables cross-database search for cooperation and network partners and discovering of the research landscape.

The dashboard provides detailed information about the selected scientist, e.g. publications. The dashboard can be filtered and shows the relationship to co-authors in different diagrams. In addition, a link is provided to find contact information.

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Materials Map under construction

The Materials Map is still under development. In its current state, it is only based on one single data source and, thus, incomplete and contains duplicates. We are working on incorporating new open data sources like ORCID to improve the quality and the timeliness of our data. We will update Materials Map as soon as possible and kindly ask for your patience.

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in Cooperation with on an Cooperation-Score of 37%

Topics

Publications (2/2 displayed)

  • 2021Effect of microwave operating power and reflow time on the microstructure and tensile properties of Sn–3.0Ag–0.5Cu/Cu solder joints10citations
  • 2019Corrosion characterization of Sn-Zn solder: a review27citations

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Mohamad, Ahmad Azmin
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Mohd Sharif, Nurulakmal
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Said, Mardiana
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Masri, Mohamad Najmi
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Gursel, Ali
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Cheani, Fakhrozi
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Yahaya, Muhamad Zamri
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2021
2019

Co-Authors (by relevance)

  • Mohamad, Ahmad Azmin
  • Mohd Sharif, Nurulakmal
  • Said, Mardiana
  • Masri, Mohamad Najmi
  • Gursel, Ali
  • Cheani, Fakhrozi
  • Yahaya, Muhamad Zamri
OrganizationsLocationPeople

article

Effect of microwave operating power and reflow time on the microstructure and tensile properties of Sn–3.0Ag–0.5Cu/Cu solder joints

  • Mohamad, Ahmad Azmin
  • Mohd Sharif, Nurulakmal
  • Mohd Nazeri, Muhammad Firdaus
  • Said, Mardiana
Abstract

Purpose This paper aims to investigate the morphology and tensile properties of SAC305 solder alloy under the influence of microwave hybrid heating (MHH) for soldering at different microwave parameters. Design/methodology/approach Si wafer was used as susceptor in MHH for solder reflow. Microwave operating power for medium and high ranging from 40 to 140 s reflow time was used to investigate their effect on the microstructure and strength of SAC305/Cu solder joints. The morphology and elemental composition of the intermetallic compound (IMC) joint were evaluated on the top surface and cross-sectional view. Findings IMC formation transformed from scallop-like to elongated scallop-like structure for medium operating power and scallop-like to planar-like structure for high operating power when exposed to longer reflow time. Compositional and phase analysis confirmed that the observed IMCs consist of Cu 6 Sn 5 , Cu 3 Sn and Ag 3 Sn. A thinner IMC layer was formed at medium operating power, 80 s (2.4 µm), and high operating power, 40 s (2.5 µm). The ultimate tensile strength at high operating power, 40 s (45.5 MPa), was 44.9% greater than that at medium operating power, 80 s (31.4 MPa). Originality/value Microwave parameters with the influence of Si wafer in MHH in soldering have been developed and optimized. A microwave temperature profile was established to select the appropriate parameter for solder reflow. For this MHH soldering method, the higher operating power and shorter reflow time are preferable.

Topics
  • morphology
  • surface
  • compound
  • phase
  • strength
  • tensile strength
  • intermetallic