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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Amalu, Dr Emeka
Teesside University
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (19/19 displayed)
- 2024Mineral wastescitations
- 2024Effect of Creep, Fatigue and Random Vibration on the Integrity of Solder Joints in BGA Packagecitations
- 2024Critical methods of geopolymer feedstocks activation for suitable industrial applicationscitations
- 2024Critical solder joint in insulated gate bipolar transistors (IGBT) power module for improved mechanical reliabilitycitations
- 2023Characterising Solder Materials from Random Vibration Response of Their Interconnects in BGA Packagingcitations
- 2023Effects of Reflow Profile and Miniaturisation on the Integrity of Solder Joints in Surface Mount Chip Resistorscitations
- 2021Thermal fatigue life of ball grid array (BGA) solder joints made from different alloy compositionscitations
- 2020Comparing and benchmarking fatigue behaviours of various SAC solders under thermo-mechanical loadingcitations
- 2019Creep damage of BGA solder interconnects subjected to thermal cycling and isothermal ageingcitations
- 20193D printing of intricate sand cores for complex copper castings
- 2018Effect of Temperature on Conductivity of PLA-Carbon 3D Printed Components.
- 2016Effects of component stand-off height on reliability of solder joints in assembled electronic component
- 2015Effect of intermetallic compounds on thermo-mechanical reliability of lead-free solder joints in solar cell assembly
- 2015A review of interconnection technologies for improved crystalline silicon solar cell photovoltaic module assemblycitations
- 2012High-temperature fatigue life of flip chip lead-free solder joints at varying component stand-off heightcitations
- 2012High temperature reliability of lead-free solder joints in a flip chip assemblycitations
- 2012Thermal management materials for electronic control unitcitations
- 2012Prediction of damage and fatigue life of high-temperature flip chip assembly interconnections at operationscitations
- 2011Effect of solder joint integrity on the thermal performance of a TEC for a 980nm pump laser module
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article
Effect of solder joint integrity on the thermal performance of a TEC for a 980nm pump laser module
Abstract
<p>Purpose - The purpose of this paper is to evaluate the effect of solder wettability on the thermal performance of a thermo-electric cooler (TEC) of a 980 nm pump laser module. Design/methodology/approach - In this paper, TEC thermal performance has been evaluated using a heat pump test. The results were compared with scanning acoustic microscopy (C-SAM) results in order to have a better understanding of the thermal behaviour of the TEC. In the C-SAM experiments, images were taken at the interfaces between the housing and TEC, as well as at the interfaces between the chip-on-carrier (CoC) and TEC. Findings - The heat pump test results indicate a strong correlation with the C-SAM test results. The C-SAM observations show good solder joint at the interface between the TEC and housing in the case of the device that yielded a good heat pump test result (11.5°C) and poor solder joints (gross de-lamination) at the interface between the TEC and housing in the case of the device that yielded a poor heat pump test result (24.4°C). The C-SAM observations did not show much difference at the interface between the CoC and TEC. The results from this study were used to qualify the post-vacuum soldered laser pump devices at JDS Uniphase, Plymouth, UK. Originality/value - The findings presented in this paper indicate that the level of solder wettability at the interfaces between the piece parts impacts the thermal performance of the TEC.</p>