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Kumar, R. P.
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article
Intensified chipping during nanoindentation and the effect of friction on the interfacial fracture for thin films used in N/MEMS
Abstract
<jats:title>Abstract</jats:title><jats:p>Nanoindentation was performed on Ti-B-Si-C and SiCN films deposited on Si substrates at varying loads and depths of penetrations. The intensity of chipping got enhanced with an increasing load which was represented geometrically. The pop-in and pop-out events occurring in the load and unloading were explained as cracking and high-pressure phase transformation. The interfacial fracture stability and adhesion of the film-substrate system, crucial for N/MEMS devices were analyzed with respect to frictional coefficient with the help of Finite Element Modelling (FEM).</jats:p>