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Naji, M. |
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Motta, Antonella |
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Aletan, Dirar |
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Mohamed, Tarek |
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Ertürk, Emre |
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Taccardi, Nicola |
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Kononenko, Denys |
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Petrov, R. H. | Madrid |
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Alshaaer, Mazen | Brussels |
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Bih, L. |
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Casati, R. |
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Muller, Hermance |
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Kočí, Jan | Prague |
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Šuljagić, Marija |
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Kalteremidou, Kalliopi-Artemi | Brussels |
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Azam, Siraj |
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Ospanova, Alyiya |
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Blanpain, Bart |
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Ali, M. A. |
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Popa, V. |
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Rančić, M. |
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Ollier, Nadège |
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Azevedo, Nuno Monteiro |
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Landes, Michael |
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Rignanese, Gian-Marco |
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Mäntysalo, Matti
Tampere University
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (18/18 displayed)
- 2025Enhancing specific capacitance and energy density in printed supercapacitors : The role of activated wood carbon and electrolyte dynamicscitations
- 2024Flexible screen-printed supercapacitors with asymmetric PANI/CDC–AC electrodes and aqueous electrolytecitations
- 2024Recyclability of novel energy harvesting and storage technologies for IoT and wireless sensor networkscitations
- 2024Monolithic supercapacitors prepared by roll-to-roll screen printingcitations
- 2023Wear reliability and failure mechanism of inkjet-printed conductors on paperboard substratecitations
- 2023Screen printable PANI/carbide-derived carbon supercapacitor electrode ink with chitosan bindercitations
- 2022Flexible Polymer Rectifying Diode on Plastic Foils with MoO3Hole Injection
- 2020Drying-Mediated Self-Assembly of Graphene for Inkjet Printing of High-Rate Micro-supercapacitorscitations
- 2020Drying-Mediated Self-Assembly of Graphene for Inkjet Printing of High-Rate Micro-supercapacitorscitations
- 2020Design of Thin, High Permittivity, Multiband, Monopole-Like Antennas
- 2019A Fully Printed Ultra-Thin Charge Amplifier for On-Skin Biosignal Measurementscitations
- 2018High-resolution E-jet Enhanced MEMS Packaging
- 2017Inkjet printing technology for increasing the I/O density of 3D TSV interposerscitations
- 2017Combination of E-jet and inkjet printing for additive fabrication of multilayer high-density RDL of silicon interposercitations
- 2016Fabrication and electrical characterization of partially metallized vias fabricated by inkjetcitations
- 2015Metallization of high density TSVs using super inkjet technologycitations
- 2010Novel Approach on Application Manufacturing Using Inkjet Printing, Laser Ablation and New Polymer Substrate
- 2009Sintering of printed nanoparticle structures using laser treatment
Places of action
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article
Wear reliability and failure mechanism of inkjet-printed conductors on paperboard substrate
Abstract
In this research, we conducted a wear test on inkjet-printed silver conductors using different loads and counter materials (two paperboards, brushed steel sheet, and sandpaper) with similar surface roughness values. The conductor’s reliability was characterized by resistance measurement, the failures and tested counter materials were analyzed using an optical microscope, profilometer, scanning electron microscope, and energy dispersive spectrometer. It was found that the counter material has a dominant impact on a conductor’s reliability and failure mechanism compared with load. The conductors were exceptionally reliable but subject to adhesive wear when tested by paperboards. They were also highly reliable when tested by brushed steel sheet although the silver became severely detached, and the conductivity was lost suddenly when a major scratch was caused by two-body and three-body abrasive wear mechanisms. Sandpaper rubbing caused the most severe silver detachment and quick loss of conductivity, as a large amount of small-size (5-15 µm) silicon carbide particles with sharp edges and corners caused a dense cutting effect via two-body abrasive wear (by cutting) mechanism. Additionally, the failures in almost all samples occurred in the areas in contact with the counter edges, suggesting that failure was accelerated by the edge effect. This study proves that inkjet-printed electronics on the investigated paperboard is exceptionally durable when rubbed by paperboards and steel sheets, and thus provides a reliable solution to intelligent packaging. To promote intelligent packaging, more paperboards, as well as approaches for reducing the edge effect can be investigated. ; Peer reviewed