• Weiland, C.
• Oneill, D.
• Snelgrove, Matthew
• Odonnell, Shane
• Oconnor, Robert
• Mcfeely, C.
• Woicik, J.
• Jose, F.
• Hughes, Greg
• Shiel, K.

Abstract

<jats:title>Abstract</jats:title><jats:p>State-of-the-art atomic layer deposition (ALD) and photoemission characterisation are applied to grow and characterise cobalt nitride, a material that has applications in renewable energy and semiconductor technologies. The growth process is characterised using an <jats:italic>in situ</jats:italic> cycle-by-cycle methodology to identify the main factors which underpin optimal material growth. The role of co-reactant dosing and substrate temperature is analysed in detail to demonstrate the impact these parameters have on the overall composition of the film. The <jats:italic>in situ</jats:italic> approach, combined with high-energy synchrotron-based photoemission studies of the resulting films, enables understanding of the bulk chemical properties without need for physical removal of material by sputtering. The results provide an insight into optimising plasma assisted ALD processes for deposition of cobalt nitride, and strategies for minimizing carbon incorporation into the film from the precursor ligands.</jats:p>

Topics

• impedance spectroscopy
• Carbon
• semiconductor
• nitride
• cobalt
• atomic layer deposition