| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Nazeri, Muhammad Firdaus Mohd
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (9/9 displayed)
- 2022Comparison of intermetallic compound growth and tensile behavior of Sn-3.0Ag-0.5Cu/Cu solder joints by conventional and microwave hybrid heatingcitations
- 2021Microstructure and Phase Investigation of Sn-58Bi-xCu Lead-Free Solder After Immersion in Sodium Chloride Solution
- 2021Selective electrochemical etching of the Sn-3Ag-0.5Cu/0.07 wt% graphene nanoparticle composite soldercitations
- 2020Corrosion Investigation of Sn-0.7Cu Pb-Free Solder in Open-Circuit and Polarized Conditionscitations
- 2020Selective etching and hardness properties of quenched SAC305 solder jointscitations
- 2020Microstructural Analysis of Sn-3.0Ag-0.5Cu-TiO2 composite solder alloy after selective electrochemical etchingcitations
- 2019Corrosion characterization of Sn-Zn solder: a review
- 2019Corrosion Assessment of Sn-0.7Cu Lead-Free Solder in 1 M Hydrochloric Acidcitations
- 2019Investigation on Passivation Behavior of Sn- 0.7Cu Solder in Different Polarizing Conditions
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article
Microstructural Analysis of Sn-3.0Ag-0.5Cu-TiO2 composite solder alloy after selective electrochemical etching
Abstract
This work aims to provide deep morphological observation on the incorporated TiO2 nanoparticles within the SAC305 by selective electrochemical etching. Cyclic voltammetry and chronoamperometry were used to investigate the selective etching performances. The removal of β-Sn matrix was conducted at a fixed potential of−350 mV. Average erformances of 2.19 and 2.30 mAwere attained from the chronoamperometry. The efficiency of β-Sn removal was pproved according to the reduction of the intensities on the phase analysis. Successful observation of the TiO2 near the Cu6Sn5 layer was attained for an optimum duration of 120 s. Clusters of TiO2 nanoparticles were entrapped by Cu6Sn5 and Ag3Sn intermetallic compound (IMC) layer network and at the solder/substrate interface. The presence of TiO2 nanoparticles at the solder interface suppresses the growth of the Cu6Sn5 IMC layer. The absence of a β-Sn matrix also allowed in-depth morphological observations to be made of the shape and size of the Cu6Sn5 and Ag3Sn. It was found that TiO2 content facilitates the β-Sn removal, which allows better observation of the IMC phases as well as the TiO2 reinforcement particles.