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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Nazeri, Muhammad Firdaus Mohd
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (9/9 displayed)
- 2022Comparison of intermetallic compound growth and tensile behavior of Sn-3.0Ag-0.5Cu/Cu solder joints by conventional and microwave hybrid heatingcitations
- 2021Microstructure and Phase Investigation of Sn-58Bi-xCu Lead-Free Solder After Immersion in Sodium Chloride Solution
- 2021Selective electrochemical etching of the Sn-3Ag-0.5Cu/0.07 wt% graphene nanoparticle composite soldercitations
- 2020Corrosion Investigation of Sn-0.7Cu Pb-Free Solder in Open-Circuit and Polarized Conditionscitations
- 2020Selective etching and hardness properties of quenched SAC305 solder jointscitations
- 2020Microstructural Analysis of Sn-3.0Ag-0.5Cu-TiO2 composite solder alloy after selective electrochemical etchingcitations
- 2019Corrosion characterization of Sn-Zn solder: a review
- 2019Corrosion Assessment of Sn-0.7Cu Lead-Free Solder in 1 M Hydrochloric Acidcitations
- 2019Investigation on Passivation Behavior of Sn- 0.7Cu Solder in Different Polarizing Conditions
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article
Corrosion Investigation of Sn-0.7Cu Pb-Free Solder in Open-Circuit and Polarized Conditions
Abstract
he corrosion performance of Sn-0.7Cu solder alloy was investigated in 1 M hydrochloride acid by means of open-circuit potential and potentiodynamic polarization techniques. In open-circuit potential measurement, the potential showed almost constant reading after achieving potential -550 mV, consistent with single dissolution peak observed in potentiodynamic polarization. This revealed single element dissolution process of Sn took place. Supporting morphological and phase analyses were done by using scanning electron microscope and X-ray diffraction. Phase analysis confirmed the corrosion product are SnO and SnO 2 . Morphological analysis showed two type of oxide layer formed as corrosion product, which are compact oxide layer and loose rod-like oxide layer after polarization, while rod-like corrosion product was diminished in open-circuit condition. This indicate that complete protection from further corrosion was impossible due to the incomplete passivation layer formation in potentiodynamic polarization.