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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Salleh, Mohd Arif Anuar Mohd
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (7/7 displayed)
- 2022Formation and Growth of Intermetallic Compounds in Lead-Free Solder Joints: A Reviewcitations
- 2022Controlling the Layer Thickness of Zinc Oxide Photoanode and the Dye-Soaking Time for an Optimal-Efficiency Dye-Sensitized Solar Cellcitations
- 2022Preliminary investigation on the correlation between mechanical properties and conductivity of low-density polyethylene/carbon black (LDPE/CB) conductive polymer composite (CPC)citations
- 2021Influence of 1.5 wt.% Bi on the Microstructure, Hardness, and Shear Strength of Sn-0.7Cu Solder Joints after Isothermal Annealingcitations
- 2020Effect of Bismuth Additions on Wettability, Intermetallic Compound, and Microhardness Properties of Sn-0.7Cu on Different Surface Finish Substratescitations
- 2020Bonding Strength Characteristics of FA-Based Geopolymer Paste as a Repair Material When Applied on OPC Substratecitations
- 2019Current advancement in electrically conductive polymer composites for electronic interconnect applications: A short reviewcitations
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document
Current advancement in electrically conductive polymer composites for electronic interconnect applications: A short review
Abstract
<jats:title>Abstract</jats:title><jats:p>The development of conductive polymer composites along with their advantages are rapidly growing to meet current demands in electronic applications. There are many types of matrix and filler that had been extensively researched in order to find the most suitable materials that can be utilized for electronic interconnect applications. Previous works carried out by researchers within the field revealed that by using melt blending techniques such as twin screw compounding and compression moulding can be used to develop conductive composite polymer such as from polypropylene (PP) incorporated with graphite as conductive filler. The conductivity of the composite can be measured using the 4-point probe technique. This short review aims to provide the latest insight in the area of electrically conductive polymer composites focused on the types of matrix and filler, processing and utilisation in electronic interconnect and other potential applications.</jats:p>