| People | Locations | Statistics |
|---|---|---|
| Naji, M. |
| |
| Motta, Antonella |
| |
| Aletan, Dirar |
| |
| Mohamed, Tarek |
| |
| Ertürk, Emre |
| |
| Taccardi, Nicola |
| |
| Kononenko, Denys |
| |
| Petrov, R. H. | Madrid |
|
| Alshaaer, Mazen | Brussels |
|
| Bih, L. |
| |
| Casati, R. |
| |
| Muller, Hermance |
| |
| Kočí, Jan | Prague |
|
| Šuljagić, Marija |
| |
| Kalteremidou, Kalliopi-Artemi | Brussels |
|
| Azam, Siraj |
| |
| Ospanova, Alyiya |
| |
| Blanpain, Bart |
| |
| Ali, M. A. |
| |
| Popa, V. |
| |
| Rančić, M. |
| |
| Ollier, Nadège |
| |
| Azevedo, Nuno Monteiro |
| |
| Landes, Michael |
| |
| Rignanese, Gian-Marco |
|
Mohd Nazeri, Muhammad Firdau
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (1/1 displayed)
Places of action
| Organizations | Location | People |
|---|
article
Effect Additions Zn on Sn-0.7Cu Lead-Free Solder: A Short Brief
Abstract
n-0.7Cu lead-free solder is an alternative solder material that suitable to replace Sn-Pb solder in electronic manufacturing. However, it has a weakness of high melting temperature and lower mechanical strength. In this study, the change in microstructure, elements, the structural and melting point of Sn-0.7Cu after the addition of different compositions of Zn element was discussed. The result shows that after adding a small amount of Zn, a refinement microstructure of Sn-0.7Cu-xZn solder alloy was obtained, and the melting point of the solder decreased from 227.7 °C to 225.7 °C. Besides, the formation new phase of was investigated by scanning electron microscope (SEM) followed by energy-dispersive x-ray spectroscopy (EDX) and x-ray diffraction (XRD). Besides, the behaviour of Sn-0.7Cu-xZn solder alloy can be further studied via open circuit potential (OCP) to determine the corrosion potential.