Materials Map

Discover the materials research landscape. Find experts, partners, networks.

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The Materials Map is an open tool for improving networking and interdisciplinary exchange within materials research. It enables cross-database search for cooperation and network partners and discovering of the research landscape.

The dashboard provides detailed information about the selected scientist, e.g. publications. The dashboard can be filtered and shows the relationship to co-authors in different diagrams. In addition, a link is provided to find contact information.

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Materials Map under construction

The Materials Map is still under development. In its current state, it is only based on one single data source and, thus, incomplete and contains duplicates. We are working on incorporating new open data sources like ORCID to improve the quality and the timeliness of our data. We will update Materials Map as soon as possible and kindly ask for your patience.

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in Cooperation with on an Cooperation-Score of 37%

Topics

Publications (1/1 displayed)

  • 2023Rad-hard RISC-V SoC and ASIP ecosystems studies for high-energy physics applications6citations

Places of action

Chart of shared publication
Borghello, G.
1 / 1 shared
Andersen, M.
1 / 2 shared
Andorno, M.
1 / 1 shared
Pejasinovic, R.
1 / 1 shared
Dhaliwal, J.
1 / 1 shared
Caratelli, A.
1 / 3 shared
Ceresa, D.
1 / 1 shared
Chart of publication period
2023

Co-Authors (by relevance)

  • Borghello, G.
  • Andersen, M.
  • Andorno, M.
  • Pejasinovic, R.
  • Dhaliwal, J.
  • Caratelli, A.
  • Ceresa, D.
OrganizationsLocationPeople

article

Rad-hard RISC-V SoC and ASIP ecosystems studies for high-energy physics applications

  • Borghello, G.
  • Andersen, M.
  • Andorno, M.
  • Pejasinovic, R.
  • Kloukinas, K.
  • Dhaliwal, J.
  • Caratelli, A.
  • Ceresa, D.
Abstract

<jats:title>Abstract</jats:title><jats:p>The increase in complexity and size of modern ASIC designs in the HEP community and the use of advanced semiconductor fabrication processes raises the need for a shift toward a more abstract design methodology, that takes advantage of modularity and programmability to achieve a faster turnaround time both for design and verification. This contribution will present two complementary approaches, one using a RISC-V based System-on-Chip (SoC) and the other based on Application-Specific Instruction set Processors (ASIP). The SoC uses the PicoRV32 open-source RISC-V core and a rad-hard version of the AMBA APB bus to connect peripherals and is primarily geared towards control and monitoring applications. This solution is a demonstrator of what can become a more complete fully radiation-tolerant SoC platform with a standardized interconnect and an IP block library, to serve as the starting point for future ASIC designs. The ASIP based approach targets more the design of data path elements and the use in data processing applications. The presented approach makes use of a commercial ASIP Designer EDA tool to demonstrate an integrated workflow to define, benchmark and optimize an ASIP for a specific use case, starting from a general-purpose processor.</jats:p>

Topics
  • impedance spectroscopy
  • semiconductor