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Publications (4/4 displayed)
- 2022Influence of Fly Ash Geopolymer Ceramic Powder Addition on Sn-3.0Ag-0.5Cu Solder Jointscitations
- 2022Microstructure Study of Mix Assembly Lead-free Sn-Ag-Cu Ball Grid Array and Sn-10Cu Solder Pastecitations
- 2022Microstructural Evolution of Cu/Sn-58Bi/Sn-3.0Ag-0.5Cu Composite Solder Joint during Isothermal Aging
- 2020Effect of Bismuth Additions on Wettability, Intermetallic Compound, and Microhardness Properties of Sn-0.7Cu on Different Surface Finish Substratescitations
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article
Influence of Fly Ash Geopolymer Ceramic Powder Addition on Sn-3.0Ag-0.5Cu Solder Joints
Abstract
<jats:title>Abstract</jats:title><jats:p>This paper reports the effect of 1.0 wt.% fly ash (FA) geopolymer ceramic powder addition in Sn-3.0Ag-0.5Cu (SAC305, in wt.%) solder joint. Powder metallurgy route was used to fabricate the new composite solder. Solder balls were formed from the new composite solder and reflowed on Cu substrate. The effect of FA as ceramic reinforcement on the bulk microstructure and the interfacial intermetallic compound layer formation of solder joints were investigated under optical microscope. Microstructure observation showed that the β-Sn dendrite size was refined in SAC305-1.0FA/Cu bulk solder joint sample than that in the non-reinforced sample. The addition of FA geopolymer ceramic powder into the solder matrix also produced a thinner intermetallic compound layer.</jats:p>