Materials Map

Discover the materials research landscape. Find experts, partners, networks.

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The Materials Map is an open tool for improving networking and interdisciplinary exchange within materials research. It enables cross-database search for cooperation and network partners and discovering of the research landscape.

The dashboard provides detailed information about the selected scientist, e.g. publications. The dashboard can be filtered and shows the relationship to co-authors in different diagrams. In addition, a link is provided to find contact information.

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Materials Map under construction

The Materials Map is still under development. In its current state, it is only based on one single data source and, thus, incomplete and contains duplicates. We are working on incorporating new open data sources like ORCID to improve the quality and the timeliness of our data. We will update Materials Map as soon as possible and kindly ask for your patience.

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Razak, Nurul Razliana Abdul

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in Cooperation with on an Cooperation-Score of 37%

Topics

Publications (4/4 displayed)

  • 2022Influence of Fly Ash Geopolymer Ceramic Powder Addition on Sn-3.0Ag-0.5Cu Solder Joints2citations
  • 2022Microstructure Study of Mix Assembly Lead-free Sn-Ag-Cu Ball Grid Array and Sn-10Cu Solder Paste1citations
  • 2022Microstructural Evolution of Cu/Sn-58Bi/Sn-3.0Ag-0.5Cu Composite Solder Joint during Isothermal Agingcitations
  • 2020Effect of Bismuth Additions on Wettability, Intermetallic Compound, and Microhardness Properties of Sn-0.7Cu on Different Surface Finish Substrates3citations

Places of action

Chart of shared publication
Zaimi, Nur Syahirah Mohamad
1 / 2 shared
Ilias, Nur Fatin Natasha
1 / 1 shared
Ramli, Mohd Izrul Izwan
2 / 3 shared
Somidin, Flora
3 / 3 shared
Zaimi, Nur Syahirah Muhammad
1 / 1 shared
Kalaiarasi, A.
1 / 1 shared
Said, Rita Mohd
1 / 2 shared
Bakar, Muhammad Fakarudin Abu
1 / 1 shared
Salleh, Mohd Arif Anuar Mohd
1 / 7 shared
Amli, Siti Farahnabilah Muhd
1 / 3 shared
Chart of publication period
2022
2020

Co-Authors (by relevance)

  • Zaimi, Nur Syahirah Mohamad
  • Ilias, Nur Fatin Natasha
  • Ramli, Mohd Izrul Izwan
  • Somidin, Flora
  • Zaimi, Nur Syahirah Muhammad
  • Kalaiarasi, A.
  • Said, Rita Mohd
  • Bakar, Muhammad Fakarudin Abu
  • Salleh, Mohd Arif Anuar Mohd
  • Amli, Siti Farahnabilah Muhd
OrganizationsLocationPeople

article

Microstructural Evolution of Cu/Sn-58Bi/Sn-3.0Ag-0.5Cu Composite Solder Joint during Isothermal Aging

  • Razak, Nurul Razliana Abdul
  • Bakar, Muhammad Fakarudin Abu
  • Somidin, Flora
Abstract

<jats:title>Abstract</jats:title><jats:p>A composite solder joints made of Cu/Sn-58Bi/Sn-3.0Ag-0.5Cu (in weight percent) was successfully fabricated. The composite solder was made from combining a Sn-3.0Ag-0.5Cu solder ball and Sn-58Bi solder paste. The composite solder was reflowed on Cu-OSP (copper-organic solderability preservatives) substrate to form a composite solder joint. The microstructure evolution of the composite solder joints under different reflow temperature and thermal aging conditions were investigated using an optical microscope. This study shows that a composite solder joint of SAC305/Sn-58Bi can be assembled at lower temperature (160 °C) and gradually mixed through isothermal aging.</jats:p>

Topics
  • microstructure
  • composite
  • copper
  • aging
  • aging