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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Nazeri, Muhammad Firdaus Mohd
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (9/9 displayed)
- 2022Comparison of intermetallic compound growth and tensile behavior of Sn-3.0Ag-0.5Cu/Cu solder joints by conventional and microwave hybrid heatingcitations
- 2021Microstructure and Phase Investigation of Sn-58Bi-xCu Lead-Free Solder After Immersion in Sodium Chloride Solution
- 2021Selective electrochemical etching of the Sn-3Ag-0.5Cu/0.07 wt% graphene nanoparticle composite soldercitations
- 2020Corrosion Investigation of Sn-0.7Cu Pb-Free Solder in Open-Circuit and Polarized Conditionscitations
- 2020Selective etching and hardness properties of quenched SAC305 solder jointscitations
- 2020Microstructural Analysis of Sn-3.0Ag-0.5Cu-TiO2 composite solder alloy after selective electrochemical etchingcitations
- 2019Corrosion characterization of Sn-Zn solder: a review
- 2019Corrosion Assessment of Sn-0.7Cu Lead-Free Solder in 1 M Hydrochloric Acidcitations
- 2019Investigation on Passivation Behavior of Sn- 0.7Cu Solder in Different Polarizing Conditions
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article
Microstructure and Phase Investigation of Sn-58Bi-xCu Lead-Free Solder After Immersion in Sodium Chloride Solution
Abstract
he changes in microstructure and phase of tin-bismuth-copper (Sn-58Bi-xCu) were investigated after immersion in 3.5 wt. % sodium chloride (NaCl) at variations of Cu micro-alloying at 0.25, 0.50, 0.75, 1.00 and 1.25 wt. %. The morphological observation revealed that the long crystal grains of the Cu-rich phase were produced as the amount of Cu increased. The phase analysis shows that at 0.5 wt. % Cu additions, the intermetallic compound od Cu 6 Sn 5 began to form and dominate the microstructure. After immersion in NaCl, a porous structure was seen covering the surface of the ternary solder, indicating the formation of a defective corrosion protection layer. The predominance of Cu 6 Sn 5 is believed to boost the galvanic corrosion coupling potential of the ternary solder. As a result, the more electrochemically reactive phase was pushed to be eliminated during immersion in 3.5 wt.% NaCl solution. Thus the black spots were formed. The presence of Cu 6 Sn 5 was seen to be detrimental to the electrochemical performance of Sn-58Bi-xCu.