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Naji, M. |
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Motta, Antonella |
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Aletan, Dirar |
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Mohamed, Tarek |
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Ertürk, Emre |
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Taccardi, Nicola |
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Kononenko, Denys |
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Petrov, R. H. | Madrid |
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Alshaaer, Mazen | Brussels |
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Bih, L. |
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Casati, R. |
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Muller, Hermance |
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Kočí, Jan | Prague |
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Šuljagić, Marija |
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Kalteremidou, Kalliopi-Artemi | Brussels |
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Azam, Siraj |
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Ospanova, Alyiya |
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Blanpain, Bart |
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Ali, M. A. |
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Popa, V. |
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Rančić, M. |
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Ollier, Nadège |
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Azevedo, Nuno Monteiro |
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Landes, Michael |
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Rignanese, Gian-Marco |
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Giagka, Vasiliki
Fraunhofer Institute for Reliability and Microintegration
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (20/20 displayed)
- 2023Non-monolithic fabrication of thin-film microelectrode arrays on PMUT transducers as a bimodal neuroscientific investigation toolcitations
- 2023Non-monolithic fabrication of thin-film microelectrode arrays on PMUT transducers as a bimodal neuroscientific investigation toolcitations
- 2023A Comparative Study of Si3N4 and Al2O3 as Dielectric Materials for Pre-Charged Collapse-Mode CMUTscitations
- 2023An Ultrasonically Powered System Using an AlN PMUT Receiver for Delivering Instantaneous mW-Range DC Power to Biomedical Implantscitations
- 2022Thin Film Encapsulation for LCP-Based Flexible Bioelectronic Implants: Comparison of Different Coating Materials Using Test Methodologies for Life-Time Estimationcitations
- 2022Thin Film Encapsulation for LCP-Based Flexible Bioelectronic Implants: Comparison of Different Coating Materials Using Test Methodologies for Life-Time Estimationcitations
- 2022Multilayer CVD graphene electrodes using a transfer-free process for the next generation of optically transparent and MRI-compatible neural interfacescitations
- 2022Multilayer CVD graphene electrodes using a transfer-free process for the next generation of optically transparent and MRI-compatible neural interfacescitations
- 2022Thin Film Encapsulation for LCP-Based Flexible Bioelectronic Implantscitations
- 2021Silicone encapsulation of thin-film SiOx , SiOx Ny and SiC for modern electronic medical implantscitations
- 2021Silicone encapsulation of thin-film SiO x , SiO x N y and SiC for modern electronic medical implants: A comparative long-term ageing studycitations
- 2021Silicone encapsulation of thin-film SiOx, SiOxNy and SiC for modern electronic medical implants: a comparative long-term ageing studycitations
- 2021Silicone encapsulation of thin-film SiOx, SiOxNy and SiC for modern electronic medical implants
- 2020Soft, flexible and transparent graphene-based active spinal cord implants for optogenetic studies
- 2020Long-term encapsulation of platinum metallization using a HfO2 ALD - PDMS bilayer for non-hermetic active implantscitations
- 2019Effect of Signals on the Encapsulation Performance of Parylene Coated Platinum Tracks for Active Medical Implantscitations
- 2019The influence of soft encapsulation materials on the wireless power transfer links efficiency
- 2019Towards an Active Graphene-PDMS Implant
- 2018MEMS-Electronics Integration 2: A Smart Temperature Sensor for an Organ-on-a-chip Platform
- 2015Flexible active electrode arrays with ASICs that fit inside the rat's spinal canalcitations
Places of action
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article
Silicone encapsulation of thin-film SiOx , SiOx Ny and SiC for modern electronic medical implants
Abstract
<p>Objective. Ensuring the longevity of implantable devices is critical for their clinical usefulness. This is commonly achieved by hermetically sealing the sensitive electronics in a water impermeable housing, however, this method limits miniaturisation. Alternatively, silicone encapsulation has demonstrated long-term protection of implanted thick-film electronic devices. However, much of the current conformal packaging research is focused on more rigid coatings, such as parylene, liquid crystal polymers and novel inorganic layers. Here, we consider the potential of silicone to protect implants using thin-film technology with features 33 times smaller than thick-film counterparts. Approach. Aluminium interdigitated comb structures under plasma-enhanced chemical vapour deposited passivation (SiO x , SiO x N y , SiO x N y + SiC) were encapsulated in medical grade silicones, with a total of six passivation/silicone combinations. Samples were aged in phosphate-buffered saline at 67 °C for up to 694 days under a continuous 5 V biphasic waveform. Periodic electrochemical impedance spectroscopy measurements monitored for leakage currents and degradation of the metal traces. Fourier-transform infrared spectroscopy, x-ray photoelectron spectroscopy, focused-ion-beam and scanning-electron- microscopy were employed to determine any encapsulation material changes. Main results. No silicone delamination, passivation dissolution, or metal corrosion was observed during ageing. Impedances greater than 100 GΩ were maintained between the aluminium tracks for silicone encapsulation over SiO x N y and SiC passivations. For these samples the only observed failure mode was open-circuit wire bonds. In contrast, progressive hydration of the SiO x caused its resistance to decrease by an order of magnitude. Significance. These results demonstrate silicone encapsulation offers excellent protection to thin-film conducting tracks when combined with appropriate inorganic thin films. This conclusion corresponds to previous reliability studies of silicone encapsulation in aqueous environments, but with a larger sample size. Therefore, we believe silicone encapsulation to be a realistic means of providing long-term protection for the circuits of implanted electronic medical devices.</p>