Materials Map

Discover the materials research landscape. Find experts, partners, networks.

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The Materials Map is an open tool for improving networking and interdisciplinary exchange within materials research. It enables cross-database search for cooperation and network partners and discovering of the research landscape.

The dashboard provides detailed information about the selected scientist, e.g. publications. The dashboard can be filtered and shows the relationship to co-authors in different diagrams. In addition, a link is provided to find contact information.

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The Materials Map is still under development. In its current state, it is only based on one single data source and, thus, incomplete and contains duplicates. We are working on incorporating new open data sources like ORCID to improve the quality and the timeliness of our data. We will update Materials Map as soon as possible and kindly ask for your patience.

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Naji, M.
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Fraunhofer Institute for Reliability and Microintegration

in Cooperation with on an Cooperation-Score of 37%

Topics

Publications (20/20 displayed)

  • 2023Non-monolithic fabrication of thin-film microelectrode arrays on PMUT transducers as a bimodal neuroscientific investigation tool2citations
  • 2023Non-monolithic fabrication of thin-film microelectrode arrays on PMUT transducers as a bimodal neuroscientific investigation tool2citations
  • 2023A Comparative Study of Si3N4 and Al2O3 as Dielectric Materials for Pre-Charged Collapse-Mode CMUTs3citations
  • 2023An Ultrasonically Powered System Using an AlN PMUT Receiver for Delivering Instantaneous mW-Range DC Power to Biomedical Implants8citations
  • 2022Thin Film Encapsulation for LCP-Based Flexible Bioelectronic Implants: Comparison of Different Coating Materials Using Test Methodologies for Life-Time Estimation15citations
  • 2022Thin Film Encapsulation for LCP-Based Flexible Bioelectronic Implants: Comparison of Different Coating Materials Using Test Methodologies for Life-Time Estimation15citations
  • 2022Multilayer CVD graphene electrodes using a transfer-free process for the next generation of optically transparent and MRI-compatible neural interfaces22citations
  • 2022Multilayer CVD graphene electrodes using a transfer-free process for the next generation of optically transparent and MRI-compatible neural interfaces22citations
  • 2022Thin Film Encapsulation for LCP-Based Flexible Bioelectronic Implants15citations
  • 2021Silicone encapsulation of thin-film SiOx , SiOx Ny and SiC for modern electronic medical implants20citations
  • 2021Silicone encapsulation of thin-film SiO x , SiO x N y and SiC for modern electronic medical implants: A comparative long-term ageing study20citations
  • 2021Silicone encapsulation of thin-film SiOx, SiOxNy and SiC for modern electronic medical implants: a comparative long-term ageing study20citations
  • 2021Silicone encapsulation of thin-film SiOx, SiOxNy and SiC for modern electronic medical implantscitations
  • 2020Soft, flexible and transparent graphene-based active spinal cord implants for optogenetic studiescitations
  • 2020Long-term encapsulation of platinum metallization using a HfO2 ALD - PDMS bilayer for non-hermetic active implants18citations
  • 2019Effect of Signals on the Encapsulation Performance of Parylene Coated Platinum Tracks for Active Medical Implants15citations
  • 2019The influence of soft encapsulation materials on the wireless power transfer links efficiencycitations
  • 2019Towards an Active Graphene-PDMS Implantcitations
  • 2018MEMS-Electronics Integration 2: A Smart Temperature Sensor for an Organ-on-a-chip Platformcitations
  • 2015Flexible active electrode arrays with ASICs that fit inside the rat's spinal canal19citations

Places of action

Chart of shared publication
Karuthedath, Cyril Baby
2 / 8 shared
Wilson, Joshua
4 / 4 shared
Velea, Andrada I.
1 / 1 shared
Gollhardt, Astrid
2 / 4 shared
Karuthedath, Cyril
1 / 3 shared
Andrada, I. Velea
1 / 1 shared
Abhilash, T. S.
1 / 8 shared
Rashidi, Amin
2 / 5 shared
Savoia, Alessandro Stuart
2 / 4 shared
Kawasaki, Shinnosuke
1 / 2 shared
Saccher, Marta
2 / 4 shared
Dekker, Ronald
3 / 11 shared
Schaijk, Rob Van
1 / 1 shared
Klootwijk, Johan H.
1 / 1 shared
Stubbe, Frederic
1 / 1 shared
Lavigne, Frederik
1 / 1 shared
Sebastian, Abhilash Thanniyil
1 / 2 shared
Kallmayer, Christine
3 / 4 shared
Nanbakhsh, K.
6 / 8 shared
Pak, Anna
2 / 2 shared
Sousa, M.
1 / 8 shared
Gompel, M. Van
1 / 1 shared
Pahl, Barbara
4 / 4 shared
Hölck, Ole
3 / 10 shared
Ritasalo, R.
1 / 4 shared
Pak, A.
1 / 1 shared
Wilson, J. M.
1 / 1 shared
Ritasalo, Riina
3 / 7 shared
Van Gompel, Matthias
1 / 2 shared
Sousa, Maria
2 / 2 shared
Bakhshaee Babaroud, Nasim
1 / 1 shared
Weingärtner, Sebastian
2 / 2 shared
Palmar, Merlin
2 / 2 shared
Velea, Andrada Iulia
1 / 1 shared
Serdijn, Wouter A.
7 / 8 shared
Vos, Frans M.
1 / 1 shared
Vollebregt, Sten
4 / 14 shared
Coletti, Chiara
2 / 3 shared
Babaroud, Nasim Bakhshaee
1 / 1 shared
Vos, Frans
1 / 1 shared
Velea, Andrada Lulia
1 / 1 shared
Gompel, Matthias Van
1 / 1 shared
Nanbakhsh, Kambiz
3 / 3 shared
Vanhoestenberghe, A.
4 / 7 shared
Donaldson, N.
5 / 8 shared
Cogan, S.
4 / 6 shared
Lamont, C.
4 / 6 shared
Idil, A. Shah
4 / 4 shared
Grego, T.
4 / 6 shared
Velea, A.
1 / 3 shared
Bourgeois, Florian
1 / 3 shared
Kluba, Marta
1 / 1 shared
Malissovas, Anastasios
1 / 1 shared
Wardhana, Gandhika K.
1 / 1 shared
Ponte, Ronaldo
1 / 2 shared
Demosthenous, A.
1 / 1 shared
Chart of publication period
2023
2022
2021
2020
2019
2018
2015

Co-Authors (by relevance)

  • Karuthedath, Cyril Baby
  • Wilson, Joshua
  • Velea, Andrada I.
  • Gollhardt, Astrid
  • Karuthedath, Cyril
  • Andrada, I. Velea
  • Abhilash, T. S.
  • Rashidi, Amin
  • Savoia, Alessandro Stuart
  • Kawasaki, Shinnosuke
  • Saccher, Marta
  • Dekker, Ronald
  • Schaijk, Rob Van
  • Klootwijk, Johan H.
  • Stubbe, Frederic
  • Lavigne, Frederik
  • Sebastian, Abhilash Thanniyil
  • Kallmayer, Christine
  • Nanbakhsh, K.
  • Pak, Anna
  • Sousa, M.
  • Gompel, M. Van
  • Pahl, Barbara
  • Hölck, Ole
  • Ritasalo, R.
  • Pak, A.
  • Wilson, J. M.
  • Ritasalo, Riina
  • Van Gompel, Matthias
  • Sousa, Maria
  • Bakhshaee Babaroud, Nasim
  • Weingärtner, Sebastian
  • Palmar, Merlin
  • Velea, Andrada Iulia
  • Serdijn, Wouter A.
  • Vos, Frans M.
  • Vollebregt, Sten
  • Coletti, Chiara
  • Babaroud, Nasim Bakhshaee
  • Vos, Frans
  • Velea, Andrada Lulia
  • Gompel, Matthias Van
  • Nanbakhsh, Kambiz
  • Vanhoestenberghe, A.
  • Donaldson, N.
  • Cogan, S.
  • Lamont, C.
  • Idil, A. Shah
  • Grego, T.
  • Velea, A.
  • Bourgeois, Florian
  • Kluba, Marta
  • Malissovas, Anastasios
  • Wardhana, Gandhika K.
  • Ponte, Ronaldo
  • Demosthenous, A.
OrganizationsLocationPeople

article

Silicone encapsulation of thin-film SiOx , SiOx Ny and SiC for modern electronic medical implants

  • Vanhoestenberghe, A.
  • Donaldson, N.
  • Nanbakhsh, K.
  • Cogan, S.
  • Lamont, C.
  • Giagka, Vasiliki
  • Idil, A. Shah
  • Grego, T.
Abstract

<p>Objective. Ensuring the longevity of implantable devices is critical for their clinical usefulness. This is commonly achieved by hermetically sealing the sensitive electronics in a water impermeable housing, however, this method limits miniaturisation. Alternatively, silicone encapsulation has demonstrated long-term protection of implanted thick-film electronic devices. However, much of the current conformal packaging research is focused on more rigid coatings, such as parylene, liquid crystal polymers and novel inorganic layers. Here, we consider the potential of silicone to protect implants using thin-film technology with features 33 times smaller than thick-film counterparts. Approach. Aluminium interdigitated comb structures under plasma-enhanced chemical vapour deposited passivation (SiO x , SiO x N y , SiO x N y + SiC) were encapsulated in medical grade silicones, with a total of six passivation/silicone combinations. Samples were aged in phosphate-buffered saline at 67 °C for up to 694 days under a continuous 5 V biphasic waveform. Periodic electrochemical impedance spectroscopy measurements monitored for leakage currents and degradation of the metal traces. Fourier-transform infrared spectroscopy, x-ray photoelectron spectroscopy, focused-ion-beam and scanning-electron- microscopy were employed to determine any encapsulation material changes. Main results. No silicone delamination, passivation dissolution, or metal corrosion was observed during ageing. Impedances greater than 100 GΩ were maintained between the aluminium tracks for silicone encapsulation over SiO x N y and SiC passivations. For these samples the only observed failure mode was open-circuit wire bonds. In contrast, progressive hydration of the SiO x caused its resistance to decrease by an order of magnitude. Significance. These results demonstrate silicone encapsulation offers excellent protection to thin-film conducting tracks when combined with appropriate inorganic thin films. This conclusion corresponds to previous reliability studies of silicone encapsulation in aqueous environments, but with a larger sample size. Therefore, we believe silicone encapsulation to be a realistic means of providing long-term protection for the circuits of implanted electronic medical devices.</p>

Topics
  • impedance spectroscopy
  • corrosion
  • thin film
  • x-ray photoelectron spectroscopy
  • aluminium
  • Silicon
  • aging
  • wire
  • infrared spectroscopy
  • microscopy
  • liquid crystal