| People | Locations | Statistics |
|---|---|---|
| Naji, M. |
| |
| Motta, Antonella |
| |
| Aletan, Dirar |
| |
| Mohamed, Tarek |
| |
| Ertürk, Emre |
| |
| Taccardi, Nicola |
| |
| Kononenko, Denys |
| |
| Petrov, R. H. | Madrid |
|
| Alshaaer, Mazen | Brussels |
|
| Bih, L. |
| |
| Casati, R. |
| |
| Muller, Hermance |
| |
| Kočí, Jan | Prague |
|
| Šuljagić, Marija |
| |
| Kalteremidou, Kalliopi-Artemi | Brussels |
|
| Azam, Siraj |
| |
| Ospanova, Alyiya |
| |
| Blanpain, Bart |
| |
| Ali, M. A. |
| |
| Popa, V. |
| |
| Rančić, M. |
| |
| Ollier, Nadège |
| |
| Azevedo, Nuno Monteiro |
| |
| Landes, Michael |
| |
| Rignanese, Gian-Marco |
|
Minea, Tiberiu
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (14/14 displayed)
- 2024Vapor chemical composition in Electron Beam Powder Bed Fusion using Ti-6Al-4V powder
- 2023Impact of self-sputtering in high power impulse magnetron sputtering (HiPIMS) with heliumcitations
- 2023Spatiotemporal characterization of evaporated atoms during electron beam melting additive manufacturing by advanced laser diagnosticscitations
- 2023The Use of Sacrificial Graphite-like Coating to Improve Fusion Efficiency of Copper in Selective Laser Meltingcitations
- 2022Saturation pressure of nonequilibrium titanium evaporation during additive manufacturing by electron powder bed fusioncitations
- 2022Saturation pressure of nonequilibrium titanium evaporation during additive manufacturing by electron powder bed fusioncitations
- 2021Modeling of high power impulse magnetron sputtering discharges with graphite targetcitations
- 2021Behavior of high current density pulsed magnetron discharge with a graphite targetcitations
- 2021Phototribology: control of friction by lightcitations
- 2020Low resistivity amorphous carbon-based thin films employed as anti-reflective coatings on coppercitations
- 2019Tuning high power impulse magnetron sputtering discharge and substrate bias conditions to reduce the intrinsic stress of TiN thin filmscitations
- 2018Influence of backscattered neutrals on the grain size of magnetron-sputtered TaN thin filmscitations
- 2017Benefits of energetic ion bombardment for tailoring stress and microstructural evolution during growth of Cu thin filmscitations
- 2017Epitaxial growth of Cu(001) thin films onto Si(001) using a single-step HiPIMS processcitations
Places of action
| Organizations | Location | People |
|---|
article
Behavior of high current density pulsed magnetron discharge with a graphite target
Abstract
<jats:title>Abstract</jats:title><jats:p>Conventional magnetron discharge with a graphite target is a technology used worldwide to deposit thin films for a large range of applications. In the last decade, the high current density sputtering regime stands out as a very interesting alternative allowing the tailoring of coating properties. The peak power density normalized to the target area can exceed 10<jats:sup>7</jats:sup> W m<jats:sup>−2</jats:sup>, leading to an important ionization of the sputtered atoms. In this paper we focused on the electrical characterization of a magnetized plasma operated at average gas pressure (5 Pa; Ar and He) with a graphite target. A cross-correlation with a high-speed gated camera and optical emission spectroscopy measurements of the plasma evolution is also given. The analysis of the plasma–surface interaction zone on the target unveiled the physical mechanisms associated with the high current density range (1.8–32.5 A cm<jats:sup>−2</jats:sup>), corresponding to several regimes of discharge. For graphite, it will be demonstrated that the gas rarefaction induced by the vapor wind is negligible due to its low sputtering yield. Thus, the gas recycling is the dominant mechanism sustaining the discharge, even for the higher discharge current regime when a spot is present. Spokes and other instabilities were also identified and are discussed.</jats:p>