• Tian, Gui Yun
• Aziz, Farah
• Abdin, Muhammad Zain Ul
• Ali, Amir

Abstract

<jats:title>Abstract</jats:title><jats:p>Direct Interfacing Technique (DIT) eradicates additional circuit requirements for sensorembedded system interface and digitization of analog signals. This technique provides advantages in designing an efficient, portable, and low-cost sensor system. Pulsed Eddy Current Testing (PECT) systems are used for thickness and defect measurements of conductive materials. Circuitous sensor interfacing methods and tedious data interpretation processes make PECT systems inapt for miniaturization and portable applications. In this&amp;#xD;work, DIT is used in conjunction with PECT for thickness estimation of conductive material. Change in the de-energizing time of a single coil probe with sample thickness with respect to air is used as a signal. The curve fitting method yields a maximum relative error of ≈ 2% in the thickness estimation. Effects of temperature and liftoff on system accuracy are also investigated. A liftoff compensation method using a 3-signal data group is proposed. It is shown that for thicknesses in the range of 0.508 mm – 3.175 mm and liftoffs up to 3.000 mm (step size: 0.500 mm), the proposed scheme produces a maximum relative error of 5.2 % only, which otherwise can go up to 50 %. The DIT and PECT combination can be applied for different structural ECT in the future.</jats:p>

Topics

• impedance spectroscopy
• aluminium
• defect