• Enrico, Alessandro

Abstract

<jats:title>Abstract</jats:title><jats:p>Scalable and cost-efficient transfer of nanomaterials and microstructures from their original fabrication substrate to a new host substrate is a key challenge for realizing heterogeneously integrated functional systems, such as sensors, photonics, and electronics. Here we demonstrate a high-throughput and versatile integration method utilizing conventional wire bonding tools to transfer-print carbon nanotubes (CNTs) and silicon microstructures. Standard ball stitch wire bonding cycles were used as scalable and high-speed pick-and-place operations to realize the material transfer. Our experimental results demonstrated successful transfer printing of single-walled CNTs (100 <jats:inline-formula><jats:inline-graphic xmlns:xlink="http://www.w3.org/1999/xlink" xlink:href="jmmab4d1fieqn001.gif" xlink:type="simple" /></jats:inline-formula>m-diameter patches) from their growth substrate to polydimethylsiloxane, parylene, or Au/parylene electrode substrates, and realization of field emission cathodes made of CNTs on a silicon substrate. Field emission measurements manifested excellent emission performance of the CNT electrodes. Further, we demonstrated the utility of a high-speed wire bonder for transfer printing of silicon microstructures (60 <jats:inline-formula><jats:inline-graphic xmlns:xlink="http://www.w3.org/1999/xlink" xlink:href="jmmab4d1fieqn002.gif" xlink:type="simple" /></jats:inline-formula>m <jats:inline-formula><jats:inline-graphic xmlns:xlink="http://www.w3.org/1999/xlink" xlink:href="jmmab4d1fieqn003.gif" xlink:type="simple" /></jats:inline-formula> 60 <jats:inline-formula><jats:inline-graphic xmlns:xlink="http://www.w3.org/1999/xlink" xlink:href="jmmab4d1fieqn004.gif" xlink:type="simple" /></jats:inline-formula>m <jats:inline-formula><jats:inline-graphic xmlns:xlink="http://www.w3.org/1999/xlink" xlink:href="jmmab4d1fieqn005.gif" xlink:type="simple" /></jats:inline-formula> 20 <jats:inline-formula><jats:inline-graphic xmlns:xlink="http://www.w3.org/1999/xlink" xlink:href="jmmab4d1fieqn006.gif" xlink:type="simple" /></jats:inline-formula>m) from the original silicon on insulator substrate to a new host substrate. The achieved placement accuracy of the CNT patches and silicon microstructures on the target substrates were within <jats:inline-formula><jats:inline-graphic xmlns:xlink="http://www.w3.org/1999/xlink" xlink:href="jmmab4d1fieqn007.gif" xlink:type="simple" /></jats:inline-formula>4 <jats:inline-formula><jats:inline-graphic xmlns:xlink="http://www.w3.org/1999/xlink" xlink:href="jmmab4d1fieqn008.gif" xlink:type="simple" /></jats:inline-formula>m. These results show the potential of using established and extremely cost-efficient semiconductor wire bonding infrastructure for transfer printing of nanomaterials and microstructures to realize integrated microsystems and flexible electronics.</jats:p>

Topics

• impedance spectroscopy
• microstructure
• Carbon
• nanotube
• semiconductor
• Silicon
• wire