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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Jansen, Henricus V.
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (13/13 displayed)
- 2013Fabrication of 3D fractal structures using nanoscale anisotropic etching of single crystalline siliconcitations
- 2010Combining retraction edge lithography and plasma etching for arbitrary contour nanoridge fabricationcitations
- 2009Characterization of MEMS-on-tube assembly: reflow bonding of borosilicate glass (Duran ®) tubes to silicon substratescitations
- 2008Fabrication of a silicon oxide stamp by edge lithography reinforced with silicon nitride for nanoimprint lithographycitations
- 2008Monolithics silicon nano-ridge fabrication by edge lithography and wet anisotropic etching of silicon
- 2007Simple technique for direct patterning of nanowires using a nanoslit shadow-maskcitations
- 2006Polymeric microsieves produced by phase separation micromoldingcitations
- 2006Nano-ridge fabrication by local oxidation of silicon edges with silicon nitride as a maskcitations
- 2005Nano-ridge fabrication by local oxidation of silicon edges with silicon nitride as a mask
- 2003Wet anisotropic etching for fluidic 1d nanochannelscitations
- 2002Wet anisotropic etching for fluidic 1D nanochannels
- 2000High resolution powder blast micromachiningcitations
- 2000Mask materials for powder blastingcitations
Places of action
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article
Characterization of MEMS-on-tube assembly: reflow bonding of borosilicate glass (Duran ®) tubes to silicon substrates
Abstract
Reflow bonding of borosilicate glass tubes to silicon wafers is a technology which has significant potential for microfluidic applications. The borosilicate glass tubes are designed to be used as an interface and package for wafer-level microfluidic devices. The strength of the resulting package has been tested by pressurizing it to failure. Failure occurred in the glass and the silicon adjacent to the bond, rather than along the bond itself. The bond formed is hermetic. The only leakage when testing the hermeticity of these bonds over a period of 1 month was due to gas diffusion through the glass. An unintended aspect of the heat treatments used for the reflow bonding was surface crystallization of the glass arising from heterogeneous nucleation and growth of cristobalite crystals. The bulk of the borosilicate glass remained unaffected by crystallization. For sufficiently large cristobalite crystals, microcracking occurred on the tube surface. Pressure test results indicated that the microcracking is not detrimental to the viability of this joining technology for microfluidic interconnections.