| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Berenschot, Erwin J. W.
University of Twente
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (36/36 displayed)
- 2024Residual Stress Analysis of Thin Film Materials for Fabricating Suspended Low Stress Si3N4 Waveguides on Sapphire
- 2022Fabrication of microstructures in the bulk and on the surface of sapphire by anisotropic selective wet etching of laser-affected volumescitations
- 2022Integration of Topological Insulator Josephson Junctions in Superconducting Qubit Circuitscitations
- 2020Massive Parallel NEMS Flow Restriction Fabricated Using Self-Aligned 3D-Crystallographic Nanolithographycitations
- 2020Fabrication of millimeter-long structures in sapphire using femtosecond infrared laser pulses and selective etchingcitations
- 2019Selective area growth and stencil lithography for in situ fabricated quantum devicescitations
- 2018Three-dimensional fractal geometry for gas permeation in microchannelscitations
- 2018Conformal Electroless Nickel Plating on Silicon Wafers, Convex and Concave Pyramids, and Ultralong Nanowirescitations
- 2018Morphology of single picosecond pulse subsurface laser-induced modifications of sapphire and subsequent selective etchingcitations
- 2016Ultra-thin nanochannel-based liquid TEM cell for EELS analysis and high resolution imaging
- 2013Fabrication of 3D fractal structures using nanoscale anisotropic etching of single crystalline siliconcitations
- 2010Self-assembled three-dimensional non-volatile memoriescitations
- 2010Combining retraction edge lithography and plasma etching for arbitrary contour nanoridge fabricationcitations
- 2009Characterization of MEMS-on-tube assembly: reflow bonding of borosilicate glass (Duran ®) tubes to silicon substratescitations
- 2008Fabrication of a silicon oxide stamp by edge lithography reinforced with silicon nitride for nanoimprint lithographycitations
- 2008Monolithics silicon nano-ridge fabrication by edge lithography and wet anisotropic etching of silicon
- 2007Spreading of thin-film metal patterns deposited on nonplanar surfaces using a shadow mask micromachined in si (110)citations
- 2006Nano-ridge fabrication by local oxidation of silicon edges with silicon nitride as a maskcitations
- 2006A novel surface micromachining process to fabricate AlN unimorph suspensions and its application for RF resonatorscitations
- 2005Nano-ridge fabrication by local oxidation of silicon edges with silicon nitride as a mask
- 2005Surface micromachined fabrication of piezoelectric ain unimorph suspension devices for rf resonator applications
- 2005Micromachined fountain pen as a tool for atomic force microscope-based nanoelectrochemical metal depositioncitations
- 2005Fabrication of surface micromachined ain piezoelectric microstructures and its potential apllication to rf resonators
- 2004Surface Micromachining Process for the Integration of AlN Piezoelectric Microstructures
- 2003A new technique for accurately defined deposition of catalyst thin films in deep flow channels of high-temperature gas microreactorscitations
- 2003Wet anisotropic etching for fluidic 1d nanochannelscitations
- 2002Wet anisotropic etching for fluidic 1D nanochannels
- 2002Fabrication and characterization of MEMS based wafer-scale palladium-silver alloy membranes for hydrogen separation and hydrogenation/dehydrogenation reactionscitations
- 2002Micromachined Palladium - Silver Alloy Membranes for Hydrogen Separation
- 2001Local anodic bonding of Kovar to Pyrex aimed at high-pressure, solvent-resistant microfluidic connectionscitations
- 2001Platinum patterning by a modified lift-off technique and its application in a silicon load cell
- 2001Failure mechanisms of pressurized microchannels, model, and experimentscitations
- 2001Selective Wafer Bonding by Surface Roughness Controlcitations
- 2000High resolution powder blast micromachiningcitations
- 2000Mask materials for powder blastingcitations
- 2000Characterization of platinum lift off technique
Places of action
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article
Characterization of MEMS-on-tube assembly: reflow bonding of borosilicate glass (Duran ®) tubes to silicon substrates
Abstract
Reflow bonding of borosilicate glass tubes to silicon wafers is a technology which has significant potential for microfluidic applications. The borosilicate glass tubes are designed to be used as an interface and package for wafer-level microfluidic devices. The strength of the resulting package has been tested by pressurizing it to failure. Failure occurred in the glass and the silicon adjacent to the bond, rather than along the bond itself. The bond formed is hermetic. The only leakage when testing the hermeticity of these bonds over a period of 1 month was due to gas diffusion through the glass. An unintended aspect of the heat treatments used for the reflow bonding was surface crystallization of the glass arising from heterogeneous nucleation and growth of cristobalite crystals. The bulk of the borosilicate glass remained unaffected by crystallization. For sufficiently large cristobalite crystals, microcracking occurred on the tube surface. Pressure test results indicated that the microcracking is not detrimental to the viability of this joining technology for microfluidic interconnections.