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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Dijk, D. J. Van
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (9/9 displayed)
- 2009Inkjet printing and adhesion characterisation of conductive tracks on a commercial printed circuit board materialcitations
- 2009Surface Modification of a PCB Substrate for Better Adhesion of Inkjet Printed Circuit Structures
- 2009A comparative study of two conductive inkjet inks for fabrication of RF circuit structures
- 2009Inkjet-printing- and electroless-plating- based fabrication of RF circuit structures on high-frequency substratescitations
- 2009Fabrication of RF Circuit Structures on a PCB Material Using Inkjet Printing-Electroless Plating and the Substrate Preparation for the Samecitations
- 2008Inkjet printing of functional inks on PCB materials
- 2007Adhesion Characterisation of Inkjet Printed Silver Tracks
- 2007Adhesion characterization of inkjet printing
- 2007Adhesion characterization of inkjet printed tracks
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article
Inkjet-printing- and electroless-plating- based fabrication of RF circuit structures on high-frequency substrates
Abstract
In this paper, a method to fabricate radio frequency (RF) circuit structures is described. This method involves inkjet printing of a silver nanoparticle-based ink on a functional substrate material to create the seed track (i.e., the seed layer), onto which copper is subsequently deposited by an electroless plating method, to obtain the desired thickness and conductivity of the RF structures. This process combination was validated by fabricating an S-band filter on a high-frequency substrate and comparing the RF performance of this filter with that of a filter fabricated using the conventional lithography-based method. The adhesion of the circuit structures to the substrate was qualitatively ascertained by the scotch tape test method. The performance of the inkjet-printed–electroless-plated filter was comparable to that of the conventional filter, thus proving the suitability of this novel method for practical RF applications.