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Elwenspoek, Michael Curt
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (17/17 displayed)
- 2009Characterization of MEMS-on-tube assembly: reflow bonding of borosilicate glass (Duran ®) tubes to silicon substratescitations
- 2008Fabrication of a silicon oxide stamp by edge lithography reinforced with silicon nitride for nanoimprint lithographycitations
- 2008Monolithics silicon nano-ridge fabrication by edge lithography and wet anisotropic etching of silicon
- 2005Growth and surface characterization of piezoelectric AlN thin films on silicon (100) and (110) substratescitations
- 2005Multifunctional tool for expanding afm-based applicationscitations
- 2003A low hydraulic capacitance pressure sensor for integration with a micro viscosity detectorcitations
- 2003Wet anisotropic etching for fluidic 1d nanochannelscitations
- 2002Wet anisotropic etching for fluidic 1D nanochannels
- 2002Fabrication and characterization of MEMS based wafer-scale palladium-silver alloy membranes for hydrogen separation and hydrogenation/dehydrogenation reactionscitations
- 2001Local anodic bonding of Kovar to Pyrex aimed at high-pressure, solvent-resistant microfluidic connectionscitations
- 2001Powder-blasting technology as an alternative tool for microfabrication of capillary electrophoresis chips with integrated conductivity sensorscitations
- 2001Failure mechanisms of pressurized microchannels, model, and experimentscitations
- 2001Selective Wafer Bonding by Surface Roughness Controlcitations
- 2000Wet and dry etching techniques for the release of sub-micrometre perforated membranescitations
- 2000High resolution powder blast micromachiningcitations
- 2000Mask materials for powder blastingcitations
- 2000Failure mechanisms of pressurized microchannels, model and experiments
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article
Fabrication of a silicon oxide stamp by edge lithography reinforced with silicon nitride for nanoimprint lithography
Abstract
The fabrication of a stamp reinforced with silicon nitride is presented for its use in nanoimprint lithography. The fabrication process is based on edge lithography using conventional optical lithography and wet anisotropic etching of 110 silicon wafers. SiO2 nano-ridges of 20 nm in width were fabricated. A silicon rich nitride layer is deposited over the original SiO2 nano-ridges to improve the ridge strength and to achieve a positive tapered shape which is beneficial for nanoimprinting. A replica of the nano-ridges with silicon rich nitride shield is obtained by imprinting the stamp into thermoplastic nanoimprint polymer mr-I 7010E