693.932 PEOPLE
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Berenschot, Erwin J. W.
University of Twente
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (36/36 displayed)
- 2024Residual Stress Analysis of Thin Film Materials for Fabricating Suspended Low Stress Si3N4 Waveguides on Sapphire
- 2022Fabrication of microstructures in the bulk and on the surface of sapphire by anisotropic selective wet etching of laser-affected volumescitations
- 2022Integration of Topological Insulator Josephson Junctions in Superconducting Qubit Circuitscitations
- 2020Massive Parallel NEMS Flow Restriction Fabricated Using Self-Aligned 3D-Crystallographic Nanolithographycitations
- 2020Fabrication of millimeter-long structures in sapphire using femtosecond infrared laser pulses and selective etchingcitations
- 2019Selective area growth and stencil lithography for in situ fabricated quantum devicescitations
- 2018Three-dimensional fractal geometry for gas permeation in microchannelscitations
- 2018Conformal Electroless Nickel Plating on Silicon Wafers, Convex and Concave Pyramids, and Ultralong Nanowirescitations
- 2018Morphology of single picosecond pulse subsurface laser-induced modifications of sapphire and subsequent selective etchingcitations
- 2016Ultra-thin nanochannel-based liquid TEM cell for EELS analysis and high resolution imaging
- 2013Fabrication of 3D fractal structures using nanoscale anisotropic etching of single crystalline siliconcitations
- 2010Self-assembled three-dimensional non-volatile memoriescitations
- 2010Combining retraction edge lithography and plasma etching for arbitrary contour nanoridge fabricationcitations
- 2009Characterization of MEMS-on-tube assembly: reflow bonding of borosilicate glass (Duran ®) tubes to silicon substratescitations
- 2008Fabrication of a silicon oxide stamp by edge lithography reinforced with silicon nitride for nanoimprint lithographycitations
- 2008Monolithics silicon nano-ridge fabrication by edge lithography and wet anisotropic etching of silicon
- 2007Spreading of thin-film metal patterns deposited on nonplanar surfaces using a shadow mask micromachined in si (110)citations
- 2006Nano-ridge fabrication by local oxidation of silicon edges with silicon nitride as a maskcitations
- 2006A novel surface micromachining process to fabricate AlN unimorph suspensions and its application for RF resonatorscitations
- 2005Nano-ridge fabrication by local oxidation of silicon edges with silicon nitride as a mask
- 2005Surface micromachined fabrication of piezoelectric ain unimorph suspension devices for rf resonator applications
- 2005Micromachined fountain pen as a tool for atomic force microscope-based nanoelectrochemical metal depositioncitations
- 2005Fabrication of surface micromachined ain piezoelectric microstructures and its potential apllication to rf resonators
- 2004Surface Micromachining Process for the Integration of AlN Piezoelectric Microstructures
- 2003A new technique for accurately defined deposition of catalyst thin films in deep flow channels of high-temperature gas microreactorscitations
- 2003Wet anisotropic etching for fluidic 1d nanochannelscitations
- 2002Wet anisotropic etching for fluidic 1D nanochannels
- 2002Fabrication and characterization of MEMS based wafer-scale palladium-silver alloy membranes for hydrogen separation and hydrogenation/dehydrogenation reactionscitations
- 2002Micromachined Palladium - Silver Alloy Membranes for Hydrogen Separation
- 2001Local anodic bonding of Kovar to Pyrex aimed at high-pressure, solvent-resistant microfluidic connectionscitations
- 2001Platinum patterning by a modified lift-off technique and its application in a silicon load cell
- 2001Failure mechanisms of pressurized microchannels, model, and experimentscitations
- 2001Selective Wafer Bonding by Surface Roughness Controlcitations
- 2000High resolution powder blast micromachiningcitations
- 2000Mask materials for powder blastingcitations
- 2000Characterization of platinum lift off technique
Places of action
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article
Wet anisotropic etching for fluidic 1d nanochannels
Abstract
In this paper a method is proposed to fabricate channels for fluidic applications with a depth in the nanometer range. Channels with smooth and straight sidewalls are constructed with the help of micromachining technology by etching shallow trenches into 110 silicon using native oxide as a mask material and OPD resist developer as the etchant. Sub-50 nm deep fluidic channels are formed after bonding the nanopatterned wafers with silicon or borofloat-glass wafers. The nanofabrication process is significantly simplified by using native oxide as the main mask material. The etch depth of the nanochannels is limited by the thickness of the native oxide layer, and by the selectivity of the oxide/silicon etch rate (estimated to be at least 250 for 110 silicon at room temperature).