| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Elwenspoek, Michael Curt
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (17/17 displayed)
- 2009Characterization of MEMS-on-tube assembly: reflow bonding of borosilicate glass (Duran ®) tubes to silicon substratescitations
- 2008Fabrication of a silicon oxide stamp by edge lithography reinforced with silicon nitride for nanoimprint lithographycitations
- 2008Monolithics silicon nano-ridge fabrication by edge lithography and wet anisotropic etching of silicon
- 2005Growth and surface characterization of piezoelectric AlN thin films on silicon (100) and (110) substratescitations
- 2005Multifunctional tool for expanding afm-based applicationscitations
- 2003A low hydraulic capacitance pressure sensor for integration with a micro viscosity detectorcitations
- 2003Wet anisotropic etching for fluidic 1d nanochannelscitations
- 2002Wet anisotropic etching for fluidic 1D nanochannels
- 2002Fabrication and characterization of MEMS based wafer-scale palladium-silver alloy membranes for hydrogen separation and hydrogenation/dehydrogenation reactionscitations
- 2001Local anodic bonding of Kovar to Pyrex aimed at high-pressure, solvent-resistant microfluidic connectionscitations
- 2001Powder-blasting technology as an alternative tool for microfabrication of capillary electrophoresis chips with integrated conductivity sensorscitations
- 2001Failure mechanisms of pressurized microchannels, model, and experimentscitations
- 2001Selective Wafer Bonding by Surface Roughness Controlcitations
- 2000Wet and dry etching techniques for the release of sub-micrometre perforated membranescitations
- 2000High resolution powder blast micromachiningcitations
- 2000Mask materials for powder blastingcitations
- 2000Failure mechanisms of pressurized microchannels, model and experiments
Places of action
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article
Powder-blasting technology as an alternative tool for microfabrication of capillary electrophoresis chips with integrated conductivity sensors
Abstract
The fabrication and characterization of a microfluidic device for capillary electrophoresis applications is presented. The device consists of a glass chip which contains a single separation channel as well as an integrated conductivity detection cell. In contrast to most microfluidic glass devices the channels are not wet etched in HF but machined by the newly developed micro powder-blasting technique which allows the creation of microstructures below 100 µm, and additionally makes parallel hole machining at very low costs outside the cleanroom environment possible [1, 2]. The integration of the conductivity detector was achieved by leading two thin-film metal electrodes inside the separation channel. For rapid sample injection the chip is mounted inside an autosampler-based capillary electrophoresis platform. The detection electrodes for conductivity detection are read out by lock-in amplifier electronics. First measurements show the successful separation of various ions in the sub-millimeter range.