693.932 PEOPLE
| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Vilkman, Marja
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (8/8 displayed)
- 2010Self-assembly of cationic rod-like poly(2,5-pyridine) by acidic bis(trifluoromethane)sulfonimide in the hydrated state:A highly-ordered self-assembled protonic conductorcitations
- 2010Substrate-facilitated nanoparticle sintering and component interconnection procedurecitations
- 2010Structural investigations and processing of electronically and protonically conducting polymers:Dissertation
- 2010Self-assembly of cationic rod-like poly(2,5-pyridine) by acidic bis(trifluoromethane)sulfonimide in the hydrated statecitations
- 2010Structural investigations and processing of electronically and protonically conducting polymers
- 2008Fabrication of thin-film organic memory elements
- 2007Metallic nanoparticles in a polymeric matrix
- 2007Metallic nanoparticles in a polymeric matrix:Electrical impedance switching and negative differential resistance
Places of action
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article
Substrate-facilitated nanoparticle sintering and component interconnection procedure
Abstract
Room temperature substrate-facilitated sintering of nanoparticles is demonstrated using commercially available silver nanoparticle ink and inkjet printing substrates. The sintering mechanism is based on the chemical removal of the nanoparticle stabilizing ligand and is shown to provide conductivity above one-fourth that of bulk silver. A novel approach to attach discrete components to printed conductors is presented, where the sintered silver provides the metallic interconnects with good electrical and mechanical properties. A process for printing and chip-on-demand assembly is suggested.