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| Naji, M. |
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Leppäniemi, Jaakko
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (11/11 displayed)
- 2020Printed, Highly Stable Metal Oxide Thin-Film Transistors with Ultra-Thin High-κ Oxide Dielectriccitations
- 2020Printed, Highly Stable Metal Oxide Thin-Film Transistors with Ultra-Thin High-κ Oxide Dielectriccitations
- 2015Gravure printed sol-gel derived AlOOH hybrid nanocomposite thin films for printed electronicscitations
- 2015Gravure printed sol-gel derived AlOOH hybrid nanocomposite thin films for printed electronicscitations
- 2014Sintering of inkjet printed silver tracks with boiling salt watercitations
- 2014Modelling of printable metal-oxide TFTs for circuit simulation
- 2012Water-based carbon-coated copper nanoparticle fluid:Formation of conductive layers at low temperature by spin coating and inkjet depositioncitations
- 2012Water-based carbon-coated copper nanoparticle fluidcitations
- 2010Substrate-facilitated nanoparticle sintering and component interconnection procedurecitations
- 2010Electrical Sintering of Conductor Grids for Optoelectronic Devices
- 2010Printable WORM and FRAM memories and their applications
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article
Substrate-facilitated nanoparticle sintering and component interconnection procedure
Abstract
Room temperature substrate-facilitated sintering of nanoparticles is demonstrated using commercially available silver nanoparticle ink and inkjet printing substrates. The sintering mechanism is based on the chemical removal of the nanoparticle stabilizing ligand and is shown to provide conductivity above one-fourth that of bulk silver. A novel approach to attach discrete components to printed conductors is presented, where the sintered silver provides the metallic interconnects with good electrical and mechanical properties. A process for printing and chip-on-demand assembly is suggested.