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Christiane, Dr. Kothe
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Publications (9/9 displayed)
- 2024Investigations on the thermo-mechanical behaviour of densified veneer wood for cryogenic applicationscitations
- 2021Mechanical and chemical analysis of structural silicone adhesives with the influence of artificial agingcitations
- 2021Thin glass in façades: Adhesive joints for thin glass composite panels with 3D printed polymer cores
- 2020Thin glass composite panels: Investigation of the adhesive joint between 3D printed polymer core and glass
- 2016Adhesive joints for bonded point fixings in façades and glass structures
- 2015Investigations on the aging resistance of sealing materials for the protection of bonded point fixings.
- 2015Investigating the resistance of sealing materials for the protection of bonded point fixings
- 2010Thermal stability of polymeric interlayer materials
- 2009Thermo Mechanical Behaviour of Polymeric Interlayer Materials
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article
Investigations on the thermo-mechanical behaviour of densified veneer wood for cryogenic applications
Abstract
In this study, the thermo-mechanical behaviour of densified veneer wood (DVW) for cryogenic applications like load-bearing insulation elements for liquid energy sources is investigated. Mechanical tests with compression parallel and transverse to the veneer plane were performed after conditioning the material at five temperature levels: +60°C, +20°C, −40°C, −78°C (dry ice) and −196°C (liquid nitrogen). The investigations showed increasing compression moduli but also increasing brittleness with decreasing temperature. The compressive strength increased with decreasing temperature until about −30°C. Below this temperature, the strength slightly decreased again. The specific heat capacity was determined in the range of −150°C to +60°C and showed a linear dependency on temperature below +20°C. Above +20°C, a non-linear increase is observed due to evaporation of bound water. Finally, a technique is presented to mould DVW boards transverse to the lamination direction with a thermo-hygro-mechanical process in order to reduce waste material associated with commonly used chipping techniques.