| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Roy, Sudipta
University of Strathclyde
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (25/25 displayed)
- 2023Influence of corrosion reactions on the pulse electrodeposition of metals and alloyscitations
- 2022Modelling the scaling-up of the nickel electroforming processcitations
- 2022Characteristics of anode materials for nickel electroformingcitations
- 2021Pulse electrodeposition of copper in the presence of a corrosion reactioncitations
- 2020Effect of water on the electrodeposition of copper from a deep eutectic solventcitations
- 2019Investigation of water absorption profile of mineral wool insulation
- 2019Electrodeposition of Fe-Sn from the chloride-based electrolytecitations
- 2019Electroforming of large scale nickel structures for leading-edge energy, aerospace and marine applications
- 2018Anodic reactions and the corrosion of copper in deep eutectic solventscitations
- 2018Pt-Ni Subsurface Alloy Catalystscitations
- 2018Electrodeposition of Cu from a water-containing deep eutectic solvent
- 2018Design of an ultrasonic tank reactor for copper deposition at electrodes separated by a narrow gapcitations
- 2017The influence of water on the cathodic voltammetric responses of choline chloride-urea and choline chloride-ethylene glycol deep eutectic solvents
- 2017Pulse plating of copper from deep eutectic solventscitations
- 2017Electrodeposition of copper from deep eutectic solvents by using pulse current
- 2017Effect of water on Cu electrodeposition from ethaline based deep eutectic solvent
- 2017Effect of water on Cu electrodeposition from ethaline based deep eutectic solvent
- 2016Metal recovery from low concentration solutions using a flow-by reactor under galvanostatic approachcitations
- 2016Sono-electrodeposition transfer of micro-scale copper patterns on to A7 substrates using a mask-less methodcitations
- 2015A soluble molecular variant of the semiconducting silicondiselenidecitations
- 2015The role of fluorosurfactant on Cu-Sn electrodeposition from methanesulfonic acidcitations
- 2015Codeposition of Cu-Sn from ethaline deep eutectic solventcitations
- 2014Effect of ultrasound on mass transfer during electrodeposition for electrodes separated by a narrow gapcitations
- 2014Electrochemical copper deposition from an ethaline-CuCl2·2H2O DEScitations
- 2012Pulse Plating
Places of action
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article
Electrodeposition of Fe-Sn from the chloride-based electrolyte
Abstract
<p>The conditions for electrodeposition of Fe-Sn alloys from a novel, environmentally friendly, ferrous chloride-based electrolyte were studied. The influence of the pH on the electrolyte stability and deposit stoichiometry was studied and discussed. Anodic stripping voltammetry (ASV), XRD and SEM/EDX were used to characterise the electrodeposited phases. The results from ASVs indicated the possibility to deposit at least two different phases at high overpotentials. Hull cell depositions in an electrolyte with a Sn to Fe ratio 1:1 and a pH value of 2.8 showed regular deposition of Fe-Sn. Fe-rich deposits (54.84 at.-%) were obtained from an electrolyte with Sn to Fe ratio 1:10. The XRD results were compatible with the electrochemical investigations. In all studied samples β-Sn, FeSn<sub>2</sub> and Fe<sub>5</sub>Sn<sub>3</sub> were detected. The presence of ferromagnetic Fe<sub>5</sub>Sn<sub>3</sub> was not influenced by the Sn to Fe ions ratio in the electrolyte.</p>