| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Cobley, Andrew
Coventry University
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (38/38 displayed)
- 2023Selective soldering nozzles
- 2023Analysis of Pre-Treatment Processes to Enable Electroplating on Nitrided Steel
- 2023The challenges in selective soldering and meeting training needs
- 2021Electroless copper plating obtained by Selective Metallisation using a Magnetic Field (SMMF)citations
- 2020The effects of turmeric on the grain structure and properties of copper electrodeposited composites
- 2020MATUROLIFE: Using Advanced Material Science to Develop the Future of Assistive Technologycitations
- 2018Ultrasound assisted electroless nickel-boron plating from alkaline borohydride bath
- 2018Mechanism for the development of Sn-Cu alloy coatings produced by pulsed current electrodepositioncitations
- 2018Selective metallization of non-conductive materials by patterning of catalytic particles and the application of a gradient magnetic fieldcitations
- 2018Additive process for patterned metallized conductive tracks on cotton with applications in smart textilescitations
- 2018Selective electroless metallization of non-conductive substrates enabled by a Fe3O4/Ag catalyst and a gradient magnetic fieldcitations
- 2017Electroless deposition of nickel-boron coatings using low frequency ultrasonic agitation: Effect of ultrasonic frequency on the coatings.citations
- 2017Electroless deposition of nickel-boron coatings using low frequency ultrasonic agitation: Effect of ultrasonic frequency on the coatings properties and the deposition of electroless Ni-B composite.
- 2016Properties of electroless Ni-B-WC composite coatings
- 2016Ultrasound assisted electrodeposition of Zn and Zn-TiO2 coatingscitations
- 2016The Effect of Mixing and Degassing Conditions on the Properties of Epoxy/Anhydride Resin System
- 2016Bismuth-based composite coating for overlay applications in plain bearings
- 2015Ultrasound-assisted electrodeposition of thin Nickel-based composite coatings with lubricant particlescitations
- 2015Effect of additive concentration during copper deposition using EnFACE electrolytecitations
- 2015Ultrasonic agitation in barrel electroplating: field trial resultscitations
- 2014Functionalised copper nanoparticles as catalysts for electroless platingcitations
- 2014Ultrasound-assisted electrodeposition of composite coatings with particlescitations
- 2013Ultrasonically enabled low temperature electroless plating for advanced electronic manufacture
- 2012Ultrasonically enabled low temperature electroless plating for sustainable electronic manufacturecitations
- 2012Initial studies to optimise the sonochemical surface modification of a high Tg laminatecitations
- 2012The use of ultrasound to enable low temperature electroless platingcitations
- 2011Initial studies into the use of ultrasound to reduce process temperatures and chemical usage in the PCB desmear processcitations
- 2010Eurointerfinish 2009citations
- 2010Through hole plating of printed circuit boards using ultrasonically dispersed copper nanoparticlescitations
- 2009Electroless methods
- 2008Improved Electroless Copper Composition
- 2006Catalytic anodes for electrodepositioncitations
- 2006Use of organic reductants to lower brightener consumption in acid copper electroplating bath utilising catalytic anodescitations
- 2004Method For Desmearing Resin Accretions And Texturing Resin Without Using Solvent
- 2003Characterisation of insoluble anodes for acid copper electrodepositioncitations
- 2003The effect of insoluble anodes on the process control and deposit quality of acid copper electroplating bathscitations
- 2001Methods for achieving high speed acid copper electroplating in the PCB industrycitations
- 2001The use of insoluble anodes in acid sulphate copper electrodeposition solutionscitations
Places of action
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article
Effect of additive concentration during copper deposition using EnFACE electrolyte
Abstract
Copper deposition from solutions using high concentration of acid, metal ions and polyethylene glycol (PEG), and bis-(3-sulphopropyl) disulphide (SPS) and chloride ions (Cl–) is well known. A recent maskless micropatterning technology, which has the potential to replace the traditional photolithographic process, called EnFACE, proposed using an acid-free, low metal ion solution which is in direct contrast to those used in standard plating technology. In this work copper has been deposited using both standard electroplating solutions and those used in the EnFACE process. In the standard electrolyte 0.63 M CuSO4 and 2.04 M H2SO4 has been used, along with Gleam additives supplied by Dow Chemicals. For the Enface electrolyte, copper deposition has been carried out without any acid, and with different concentrations of additives between 17% - 200% of those recommended by suppliers. 25 µm of metal has been plated on stainless steel coupons as suggested by ASTM, peeled off and subjected to ductility and resistance measurements. Scanning electron microscopy and electron back scatter diffraction have been carried out to determine the deposit morphology. It was found that copper deposits obtained from acid-free solutions containing low concentration of metal ion and additives produced copper deposits with properties which are comparable to those obtained from standard electrolytes. The optimum additive concentration for the EnFACE electrolyte was 50% of the supplier recommended value.