Materials Map

Discover the materials research landscape. Find experts, partners, networks.

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The Materials Map is an open tool for improving networking and interdisciplinary exchange within materials research. It enables cross-database search for cooperation and network partners and discovering of the research landscape.

The dashboard provides detailed information about the selected scientist, e.g. publications. The dashboard can be filtered and shows the relationship to co-authors in different diagrams. In addition, a link is provided to find contact information.

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The Materials Map is still under development. In its current state, it is only based on one single data source and, thus, incomplete and contains duplicates. We are working on incorporating new open data sources like ORCID to improve the quality and the timeliness of our data. We will update Materials Map as soon as possible and kindly ask for your patience.

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in Cooperation with on an Cooperation-Score of 37%

Topics

Publications (3/3 displayed)

  • 2021project ameliz patterning techniques for copper electroplated metallization on heterojunction solar cells3citations
  • 2020PROJECT AMELIZ: PATTERNING TECHNIQUES FOR COPPER ELECTROPLATED METALLIZATION ON HETEROJUNCTION CELLScitations
  • 2020PROJECT AMELIZ: PATTERNING TECHNIQUES FOR COPPER ELECTROPLATED METALLIZATION ON HETEROJUNCTION CELLScitations

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Chart of shared publication
Andreatta, Gaëlle
3 / 4 shared
Leon, Juan J. Diaz
1 / 1 shared
Lachowicz, Agata
3 / 5 shared
Badel, Nicolas
1 / 1 shared
Fontaine, Charly
3 / 3 shared
Allebe, Christophe
1 / 1 shared
Nicolay, Sylvain
3 / 7 shared
Faes, Antonin
3 / 9 shared
Haumesser, Paul-Henri
3 / 8 shared
Jourdan, Johann
3 / 4 shared
Despeisse, Matthieu
3 / 5 shared
Darmon, Maxime
1 / 1 shared
Blondiaux, Nicolas
3 / 5 shared
Leon, Juan Diaz
1 / 1 shared
Ballif, Christophe
2 / 23 shared
Allébe, Christophe
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Christmann, Gabriel
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Darnon, Maxime
2 / 12 shared
Diaz Leon, Juan, J.
1 / 1 shared
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2021
2020

Co-Authors (by relevance)

  • Andreatta, Gaëlle
  • Leon, Juan J. Diaz
  • Lachowicz, Agata
  • Badel, Nicolas
  • Fontaine, Charly
  • Allebe, Christophe
  • Nicolay, Sylvain
  • Faes, Antonin
  • Haumesser, Paul-Henri
  • Jourdan, Johann
  • Despeisse, Matthieu
  • Darmon, Maxime
  • Blondiaux, Nicolas
  • Leon, Juan Diaz
  • Ballif, Christophe
  • Allébe, Christophe
  • Christmann, Gabriel
  • Darnon, Maxime
  • Diaz Leon, Juan, J.
OrganizationsLocationPeople

article

project ameliz patterning techniques for copper electroplated metallization on heterojunction solar cells

  • Godard, Maxime
  • Andreatta, Gaëlle
  • Leon, Juan J. Diaz
  • Lachowicz, Agata
  • Badel, Nicolas
  • Fontaine, Charly
  • Allebe, Christophe
  • Nicolay, Sylvain
  • Faes, Antonin
  • Haumesser, Paul-Henri
  • Jourdan, Johann
  • Despeisse, Matthieu
  • Darmon, Maxime
  • Blondiaux, Nicolas
Abstract

For the current PV production about 2000 tons of silver are consumed per year, 10% of the entire world annual silver supply. The PV production is expected to grow significantly in the next decades in order to enable the energy transition to 100% renewables. Annual production volumes in the terawatt range are predicted already for 2030 and this may lead to higher silver price and put more pressure on the industry to replace silver by copper. Within the Ameliz project several patterning approaches for copper electrodeposition on heterojunction cells are developed: firstly, patterning by printing a metal seed grid with a dielectric layer as plating mask and secondly masking by a monolayer of self-assembling molecules. These molecules consist of a phosphonic acid group and a hydrocarbon chain. They are bonded to the ITO surface and form a monolayer of well-ordered, densely packed hydrophobic chains, which protects the ITO surface against plating solutions. Furthermore, methods for selective formation of a copper seed layer by electrografting and for improved adhesion by ITO reduction are being investigated.

Topics
  • impedance spectroscopy
  • surface
  • silver
  • copper
  • electrodeposition