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Naji, M. |
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Motta, Antonella |
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Aletan, Dirar |
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Mohamed, Tarek |
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Ertürk, Emre |
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Taccardi, Nicola |
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Kononenko, Denys |
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Petrov, R. H. | Madrid |
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Alshaaer, Mazen | Brussels |
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Bih, L. |
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Casati, R. |
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Muller, Hermance |
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Kočí, Jan | Prague |
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Šuljagić, Marija |
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Kalteremidou, Kalliopi-Artemi | Brussels |
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Azam, Siraj |
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Ospanova, Alyiya |
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Blanpain, Bart |
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Ali, M. A. |
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Popa, V. |
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Rančić, M. |
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Ollier, Nadège |
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Azevedo, Nuno Monteiro |
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Landes, Michael |
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Rignanese, Gian-Marco |
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Andreatta, Gaëlle
Alfsen og Gunderson (Norway)
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (4/4 displayed)
- 2023Interface passivation for 31.25%-efficient perovskite/silicon tandem solar cellscitations
- 2021project ameliz patterning techniques for copper electroplated metallization on heterojunction solar cellscitations
- 2020PROJECT AMELIZ: PATTERNING TECHNIQUES FOR COPPER ELECTROPLATED METALLIZATION ON HETEROJUNCTION CELLS
- 2020PROJECT AMELIZ: PATTERNING TECHNIQUES FOR COPPER ELECTROPLATED METALLIZATION ON HETEROJUNCTION CELLS
Places of action
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article
project ameliz patterning techniques for copper electroplated metallization on heterojunction solar cells
Abstract
For the current PV production about 2000 tons of silver are consumed per year, 10% of the entire world annual silver supply. The PV production is expected to grow significantly in the next decades in order to enable the energy transition to 100% renewables. Annual production volumes in the terawatt range are predicted already for 2030 and this may lead to higher silver price and put more pressure on the industry to replace silver by copper. Within the Ameliz project several patterning approaches for copper electrodeposition on heterojunction cells are developed: firstly, patterning by printing a metal seed grid with a dielectric layer as plating mask and secondly masking by a monolayer of self-assembling molecules. These molecules consist of a phosphonic acid group and a hydrocarbon chain. They are bonded to the ITO surface and form a monolayer of well-ordered, densely packed hydrophobic chains, which protects the ITO surface against plating solutions. Furthermore, methods for selective formation of a copper seed layer by electrografting and for improved adhesion by ITO reduction are being investigated.