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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Takenaka, Mitsuru
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (8/8 displayed)
- 2022(Digital Presentation) Ge-on-insulator Platform for Mid-infrared Photonic Integrated Circuitscitations
- 2019InGaSb-on-insulator p-channel metal-oxide-semiconductor field-effect transistors on Si fabricated by direct wafer bondingcitations
- 2015Ultrathin body GaSb-on-insulator p-channel metal-oxide-semiconductor field-effect transistors on Si fabricated by direct wafer bondingcitations
- 2014Study on electrical properties of metal/GaSb junctions using metal-GaSb alloyscitations
- 2012Impact of atomic layer deposition temperature on HfO2/InGaAs metal-oxide-semiconductor interface propertiescitations
- 2010High Quality Thin Body III-V-On-Insulator Channel Layer Transfer on Si Wafer Using Direct Wafer Bondingcitations
- 2010(Invited) III-V-On-Insulator MOSFETs on Si Substrates Fabricated by Direct Bonding Techniquecitations
- 2010III-V-semiconductor-on-insulator n-channel metal-insulator-semiconductor field-effect transistors with buried Al2O3 layers and sulfur passivation: Reduction in carrier scattering at the bottom interfacecitations
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article
InGaSb-on-insulator p-channel metal-oxide-semiconductor field-effect transistors on Si fabricated by direct wafer bonding
Abstract
<jats:p>InGaSb-on-insulator (InGaSb-OI) and InAs/InGaAs/InAs-on-insulator (InAs/InGaAs-OI) structures have been realized on Si by a direct wafer bonding (DWB) technology using atomic-layer-deposition Al2O3. While strain introduced in InGaSb channel layers grown on InAs can enhance the hole mobility of the Sb-based channel layers, a difficult issue of fabricating InGaSb-OI wafers is to obtain a smooth InGaSb surface, which is mandatory for wafer bonding. In this study, the surface of a 20-nm-thick In0.185Ga0.815Sb channel grown on an InAs (100) substrate and an InAs (2.5 nm)/In0.185Ga0.815Sb (20 nm)/InAs (2.5 nm) channel with a 20-nm-thick GaSb buffer layer grown on an InAs (100) substrate by metal-organic chemical vapor deposition have a root mean square of the surface roughness as low as 0.16 and 0.22 nm, respectively, over a scan area of 10 × 10 μm2, which are smooth enough to employ the wafer bonding. As a result, the fabrication of the InGaSb-OI wafers by the DWB and the operation of InGaSb-OI p-channel metal-oxide-semiconductor field-effect transistors (p-MOSFETs) by using the DWB wafers are demonstrated. Also, the performance of InGaSb-OI p-MOSFETs is found to be improved by inserting ultrathin InAs layers between InGaSb and insulating buried oxide layers. An InGaSb-OI and an InAs/InGaAs-OI p-MOSFET under the accumulation-mode operation exhibit a peak mobility of ∼161 and ∼273 cm2/V s, respectively. The channel hole mobility of the InGaSb-OI p-MOSFET is higher than that of the GaSb-on-insulator (GaSb-OI) p-MOSFET and can exceed that of Si p-MOSFETs.</jats:p>