| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Panchenko, Juliana
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (23/23 displayed)
- 2024Laboratory X-ray Microscopy of 3D Nanostructures in the Hard X-ray Regime Enabled by a Combination of Multilayer X-ray Opticscitations
- 2023Intermetallic Growth Study of Ultra-Thin Copper and Tin Bilayer for Hybrid Bonding Applicationscitations
- 2023Cu-Cu Thermocompression Bonding with a Self-Assembled Monolayer as Oxidation Protection for 3D/2.5D System Integrationcitations
- 2022Corrosion study on Cu/Sn-Ag solid-liquid interdiffusion microbumps by salt spray testing with 5 wt.% NaCl solutioncitations
- 2022Metallurgical aspects and joint properties of Cu-Ni-In-Cu fine-pitch interconnects for 3D integrationcitations
- 2022Determination of melting and solidification temperatures of Sn-Ag-Cu solder spheres by infrared thermographycitations
- 2020Grain Structure Analysis of Cu/SiO2 Hybrid Bond Interconnects after Reliability Testingcitations
- 2020Low temperature solid state bonding of Cu-In fine-pitch interconnects
- 2020Morphologies of Primary Cu6Sn5 and Ag3Sn Intermetallics in Sn–Ag–Cu Solder Ballscitations
- 2020Grain Structure Analysis of Cu/SiO2Hybrid Bond Interconnects after Reliability Testingcitations
- 2019Effects of isothermal storage on grain structure of Cu/Sn/Cu microbump interconnects for 3D stackingcitations
- 2018Morphology Variations of Primary Cu6Sn5 Intermetallics in Lead-Free Solder Ballscitations
- 2018Characterization of low temperature Cu/In bonding for fine-pitch interconnects in three-dimensional integrationcitations
- 2017Influence of flux-assisted isothermal storage on intermetallic compounds in Cu/SnAg microbumpscitations
- 2017Fabrication and characterization of precise integrated titanium nitride thin film resistors for 2.5D interposercitations
- 2014Degradation of Cu6Sn5 intermetallic compound by pore formation in solid-liquid interdiffusion Cu/Sn microbump interconnectscitations
- 2013Microstructure investigation of Cu/SnAg solid-liquid interdiffusion interconnects by Electron Backscatter Diffractioncitations
- 2012Effects of bonding pressure on quality of SLID interconnectscitations
- 2011The creep behaviour and microstructure of ultra small solder jointscitations
- 2011Solidification processes in the Sn-rich part of the SnCu systemcitations
- 2010Microstructure Characterization Of Lead‐Free Solders Depending On Alloy Compositioncitations
- 2010The scaling effect on microstructure and creep properties of Sn-based solderscitations
- 2010Metallographic preparation of the SnAgCu solders for optical microscopy and EBSD Investigationscitations
Places of action
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booksection
Microstructure Characterization Of Lead‐Free Solders Depending On Alloy Composition
Abstract
Fatigue and crack nucleation in solder joints is basically associated with changes in the microstructure. Therefore the microstructure evolution of SnAgCu solder joints during solidification and subsequent application is an important subject for reliability investigations and physics of failure analysis. The scope of this study is a systematic overview of the as-cast microstructures in small sized lead-free SnAgCu solder spheres after solidification. A total of 32 alloy compositions have been investigated with varying Ag content from 0 to 5 wt. % and varying Cu content from 0 to 1.2 wt. %. The solder spheres had a diameter of approx. 270 μm and were all manufactured under the similar conditions. Subsequent cross-sectioning was carried out in order to analyze the microstructure by optical and electron microscopy as well as Electron Backscatter Diffraction and Energy Dispersive X-ray Spectroscopy. The results allow a comprehensive overview of the dependence of the as-cast microstructure on the solder composition. It is shown that strong changes in microstructure can be caused by small changes in solder composition. In addition, a solidification phenomenon known as cyclic twinning has been found in the samples. Three different microstructures related to that phenomenon will be presented and detailed characterizations of these structures are given in this study. These microstructures differ in their appearance by solidification morphology, phase distribution as well as grain structure and can be described as follows: 1. large dentritic areas of different grain orientations which are characterized by approx. 60° twin boundaries; 2. areas of small β-Sn cells with approx. 60° twin relation and larger intermetallic precipitates; 3. large grains consisting of a β-Sn matrix with very fine intermetallic precipitates and high angle grain boundaries between adjacent grains.