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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Ayas, Can
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Topics
Publications (8/8 displayed)
- 2023Holistic computational design within additive manufacturing through topology optimization combined with multiphysics multi-scale materials and process modellingcitations
- 2023Design for material properties of additively manufactured metals using topology optimizationcitations
- 2022Combined effects of stress and temperature on hydrogen diffusion in non-hydride forming alloys applied in gas turbinescitations
- 2021Hydrogen diffusion under the effect of stress and temperature gradients
- 2019A mold insert case study on topology optimized design for additive manufacturing
- 2019Topology optimization of an injection mold insert with additive manufacturing constraints
- 2019Improving the manufacturability of metal AM parts
- 2010A continuum framework for grain boundary diffusion in thin film/substrate systemscitations
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article
A continuum framework for grain boundary diffusion in thin film/substrate systems
Abstract
A two-dimensional continuum model is developed for stress relaxation in thin films through grain boundary (GB) diffusion. When a thin film with columnar grains is subjected to thermal stress, stress gradients along the GBs are relaxed by diffusion of material from the film surface into the GBs. The transported material constitutes a wedge and becomes the source of stress inside the adjacent elastic grains that are perfectly bonded to the substrate. In the model, the coupling between diffusion and elasticity is obtained by numerically solving the governing equations in a staggered manner. A finite difference scheme is used to solve the diffusion equations, modified in order to implement realistic boundary conditions, while the elasticity problem is solved with the finite element method. The solutions reveal the existence of a universal power law scaling between the unrelaxed fraction of stress and the grain aspect ratio. For slender grains, the GB wedge attains a more uniform shape and relaxation is more effective. The kinetics of the process depends not only on the grain aspect ratio but also strongly on the thickness of the film. In case there is no adhesion between film and substrate, complete stress relaxation is attained albeit at a slightly slower rate.