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White, J. M.
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article
Study of Copper Diffusion Through Ruthenium Thin Film by Photoemission Electron Microscopy
Abstract
Photoemission electron microscopy (PEEM) is employed to study Cu diffusion in real time through a Ru barrier in a Cu/Ru bilayer system. The PEEM images display large contrast between Cu and Ru due of the differences in work function between the two metals, making PEEM an ideal methodology to study diffusion in real time. At low temperature (175-290 °C), Cu mainly diffuses through the defective sites in the Ru film. Uniform diffusion of Cu through a Ru thin film occurs at approximately 300 °C. The results are confirmed by X-ray photoemission spectroscopy (XPS) depth profiling and scanning electron microscopy-energy dispersive X-ray spectroscopy (SEM-EDS) analysis.