Materials Map

Discover the materials research landscape. Find experts, partners, networks.

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The Materials Map is an open tool for improving networking and interdisciplinary exchange within materials research. It enables cross-database search for cooperation and network partners and discovering of the research landscape.

The dashboard provides detailed information about the selected scientist, e.g. publications. The dashboard can be filtered and shows the relationship to co-authors in different diagrams. In addition, a link is provided to find contact information.

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Materials Map under construction

The Materials Map is still under development. In its current state, it is only based on one single data source and, thus, incomplete and contains duplicates. We are working on incorporating new open data sources like ORCID to improve the quality and the timeliness of our data. We will update Materials Map as soon as possible and kindly ask for your patience.

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in Cooperation with on an Cooperation-Score of 37%

Topics

Publications (4/4 displayed)

  • 2007Poisson's Ratio of Low-Temperature PECVD Silicon Nitride Thin Films30citations
  • 2007Process condition dependence of mechanical and physical properties of silicon nitride thin films10citations
  • 2005Characterization of Mechanical Properties of Silicon Nitride Thin Films for MEMS Devices by Nanoindentationcitations
  • 2005Effects of deposition temperature on the mechanical and physical properties of silicon nitride thin films27citations

Places of action

Chart of shared publication
Liu, Yinong
4 / 35 shared
Dell, John
4 / 20 shared
Walmsley, B. A.
3 / 3 shared
Faraone, Lorenzo
4 / 31 shared
Keating, Adrian
1 / 7 shared
Musca, Charles
1 / 8 shared
Winchester, K. J.
2 / 3 shared
Huang, H.
1 / 12 shared
Martyniuk, Mariusz
1 / 16 shared
Chart of publication period
2007
2005

Co-Authors (by relevance)

  • Liu, Yinong
  • Dell, John
  • Walmsley, B. A.
  • Faraone, Lorenzo
  • Keating, Adrian
  • Musca, Charles
  • Winchester, K. J.
  • Huang, H.
  • Martyniuk, Mariusz
OrganizationsLocationPeople

article

Effects of deposition temperature on the mechanical and physical properties of silicon nitride thin films

  • Bush, Mark
  • Liu, Yinong
  • Dell, John
  • Walmsley, B. A.
  • Winchester, K. J.
  • Martyniuk, Mariusz
  • Faraone, Lorenzo
Abstract

This study investigates the mechanical and physical properties of low-temperature plasma-enhanced chemical-vapor-deposited silicon nitride thin films, with particular respect to the effect of deposition temperature. The mechanical properties of the films were evaluated by both nanoindentation and microcantilever beam-bending techniques. The cantilever beam specimens were fabricated from silicon nitride thin films deposited on (100) silicon wafer by bulk micromachining. The density of the films was determined from quartz crystal microbalance measurements, as well as from the resonant modes of the cantilever beams, which were mechanically excited using an atomic force microscope. It was found that both the Young's modulus and density of the films were significantly reduced with decreasing deposition temperature. The decrease in Young's modulus is attributed to the decreasing material density. The decrease in density with decreasing deposition temperature is believed to be due to the slower diffusion rates of the deposited species, which retarded the densification of the film during the deposition process. (c) 2005 American Institute of Physics.

Topics
  • Deposition
  • density
  • impedance spectroscopy
  • thin film
  • nitride
  • nanoindentation
  • Silicon
  • densification