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| Naji, M. |
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Shacham, Yosi
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Topics
Publications (11/11 displayed)
- 2020Fracture strength and fatigue endurance in Gd-doped ceria thermal actuatorscitations
- 2019Femtosecond laser processing of ceria-based micro actuatorscitations
- 2018Towards fully polymeric electroactive micro actuators with conductive polymer electrodescitations
- 2012Nano-imprinting lithography of P(VDF-TrFE-CFE) for flexible freestanding MEMS devicescitations
- 2009Metallization technologies and strategies for plastic based biochips, sensors and actuators for healthcare and medical applicationscitations
- 2003Copper grain boundary diffusion in electroless deposited cobalt based films and its influence on diffusion barrier integrity for copper metallizationcitations
- 2003Structure of electroless deposited Co0.9W0.02P 0.08 thin films and their evolution with thermal annealingcitations
- 2003 The role of microstructure in nanocrystalline conformal Co 0.9 W 0.02 P 0.08 diffusion barriers for copper metallization citations
- 2002Improved diffusion barriers for copper metallization obtained by passivation of grain boundaries in electroless deposited cobalt-based filmscitations
- 2001Evaluation of electroless deposited Co(W,P) thin films as diffusion barriers for copper metallizationcitations
- 2001Characterization of electroless deposited Co (W,P) thin films for encapsulation of copper metallizationcitations
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article
Structure of electroless deposited Co0.9W0.02P 0.08 thin films and their evolution with thermal annealing
Abstract
<p>The structure of electroless deposited Co<sub>0.9</sub>W <sub>0.02</sub>P<sub>0.08</sub> thin films and their evolution with thermal annealing were presented. It was shown that as-deposited microstructure was comprised of an amorphous CoWP component and nanocrystallites of hexagonal-close-packed (hcp) Co, approximately 5 nm in size. The isothermal anneals showed that the rate of nucleation with time of the hcp Co grains was constant.</p>