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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Poulsen, Carl Esben
in Cooperation with on an Cooperation-Score of 37%
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Publications (5/5 displayed)
- 2016All-polymer microfluidic systems for droplet based sample analysis:Bringing droplet technologies to life: Bridging the gap between academia and industry
- 2016Laser ablated micropillar energy directors for ultrasonic welding of microfluidic systemscitations
- 2016MICRO-SCALE ENERGY DIRECTORS FOR ULTRASONIC WELDING
- 2015Ultrasonic welding for fast bonding of self-aligned structures in lab-on-a-chip systemscitations
- 2014Fabrication and modelling of injection moulded all-polymer capillary microvalves for passive microfluidic controlcitations
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article
Ultrasonic welding for fast bonding of self-aligned structures in lab-on-a-chip systems
Abstract
Ultrasonic welding is a rapid, promising bonding method for the bonding of polymer chips; yet its use is still limited. We present two lab-on-a-chip applications where ultrasonic welding can be preferably applied: (1) Self-aligned gapless bonding of a two-part chip with a tolerance of 50 um; (2) bonding of a large area shallow chamber (1.8 cm^2 X 150 um). Using injection moulding combined with ultrasonic welding we achieved a total production and bonding time of 60 s per chip, and a batch of chips could be produced within a day going from design to finished chips. We believe that the technical solutions offered here can significantly help bridge the gap between academia and industry, where the differences in production methods and materials pose a challenge when transferring technology.