| People | Locations | Statistics |
|---|---|---|
| Naji, M. |
| |
| Motta, Antonella |
| |
| Aletan, Dirar |
| |
| Mohamed, Tarek |
| |
| Ertürk, Emre |
| |
| Taccardi, Nicola |
| |
| Kononenko, Denys |
| |
| Petrov, R. H. | Madrid |
|
| Alshaaer, Mazen | Brussels |
|
| Bih, L. |
| |
| Casati, R. |
| |
| Muller, Hermance |
| |
| Kočí, Jan | Prague |
|
| Šuljagić, Marija |
| |
| Kalteremidou, Kalliopi-Artemi | Brussels |
|
| Azam, Siraj |
| |
| Ospanova, Alyiya |
| |
| Blanpain, Bart |
| |
| Ali, M. A. |
| |
| Popa, V. |
| |
| Rančić, M. |
| |
| Ollier, Nadège |
| |
| Azevedo, Nuno Monteiro |
| |
| Landes, Michael |
| |
| Rignanese, Gian-Marco |
|
Niklaus, Frank
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (19/19 displayed)
- 2023Three-dimensional printing of silica glass with sub-micrometer resolutioncitations
- 2023Three-dimensional printing of silica glass with sub-micrometer resolutioncitations
- 2022Wafer-level hermetically sealed silicon photonic MEMScitations
- 2022Wafer-level hermetically sealed silicon photonic MEMScitations
- 2020Bactericidal surfaces prepared by femtosecond laser patterning and layer-by-layer polyelectrolyte coatingcitations
- 2019Transfer printing of nanomaterials and microstructures using a wire bondercitations
- 2018Direct observation of grain boundaries in graphene through vapor hydrofluoric acid (VHF) exposurecitations
- 2018Through-Glass Vias for MEMS Packaging
- 2017Inkjet printing technology for increasing the I/O density of 3D TSV interposerscitations
- 2017Wafer-level vacuum packaging enabled by plastic deformation and low-temperature welding of copper sealing rings with a small footprintcitations
- 2015Nanoelectromechanical digital logic circuits using curved cantilever switches with amorphous-carbon-coated contactscitations
- 2015CMOS-Integrated Si/SiGe Quantum-Well Infrared Microbolometer Focal Plane Arrays Manufactured With Very Large-Scale Heterogeneous 3-D Integrationcitations
- 2013Electromechanical Piezoresistive Sensing in Suspended Graphene Membranescitations
- 2013Unconventional applications of wire bonding create opportunities for microsystem integrationcitations
- 2013Dry adhesive bonding of nanoporous inorganic membranes to microfluidic devices using the OSTE(+) dual-cure polymercitations
- 2012Wire-bonder-assisted integration of non-bondable SMA wires into MEMS substratescitations
- 2012Very high aspect ratio through-silicon vias (TSVs) fabricated using automated magnetic assembly of nickel wirescitations
- 2011Fabrication of high aspect ratio through silicon vias (TSVs) by magnetic assembly of nickel wirescitations
- 2011Wafer-level integration of NiTi shape memory alloy wires for the fabrication of microactuators using standard wire bonding technologycitations
Places of action
| Organizations | Location | People |
|---|
article
Inkjet printing technology for increasing the I/O density of 3D TSV interposers
Abstract
Interposers with through-silicon vias (TSVs) play a key role in the three-dimensional integration and packaging of integrated circuits and microelectromechanical systems. In the current practice of fabricating interposers, solder balls are placed next to the vias; however, this approach requires a large foot print for the input/output (I/O) connections. Therefore, in this study, we investigate the possibility of placing the solder balls directly on top of the vias, thereby enabling a smaller pitch between the solder balls and an increased density of the I/O connections. To reach this goal, inkjet printing (that is, piezo and super inkjet) was used to successfully fill and planarize hollow metal TSVs with a dielectric polymer. The under bump metallization (UBM) pads were also successfully printed with inkjet technology on top of the polymer-filled vias, using either Ag or Au inks. The reliability of the TSV interposers was investigated by a temperature cycling stress test (−40 °C to +125 °C). The stress test showed no impact on DC resistance of the TSVs; however, shrinkage and delamination of the polymer was observed, along with some micro-cracks in the UBM pads. For proof of concept, SnAgCu-based solder balls were jetted on the UBM pads.<br/>