| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Berthelot, Thomas
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (14/14 displayed)
- 2018Measuring Dirac Cones in a Subwavelength Metamaterialcitations
- 2017Slow waves in locally resonant metamaterials line defect waveguidescitations
- 2016Slow waves in locally resonant metamaterials line defect waveguides
- 2016Inkjet Printing NiO-Based p-Type Dye-Sensitized Solar Cellscitations
- 2015Local surface modification via confined electrochemical deposition with FluidFMcitations
- 2015Local surface modification via confined electrochemical deposition with FluidFM †citations
- 2014VUV grafting process: An efficient tool for 3D bulk patterning of polymer sheetscitations
- 2013Polymer grafting by inkjet printing: a direct chemical writing toolsetcitations
- 2011Localized Ligand Induced Electroless Plating (LIEP) Process for the fabrication of copper patterns onto flexible polymer substratescitations
- 2011Elaboration of Nanostructured and Highly Proton Conductive Membranes for PEMFC by Ion Track Grafting Technique.
- 20113D-amino-induced electroless plating process: a powerful toolset for localized metallization onto polymers substratescitations
- 2010Microscopic study of a ligand-induced electroless plating process onto polymerscitations
- 2010ABS Polymer Electroless Plating through a One-Step Poly(acrylic acid) Covalent Graftingcitations
- 2009On the structure-property relationship of the AMV anion-exchange membranecitations
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article
Microscopic study of a ligand-induced electroless plating process onto polymers
Abstract
The ligand induced electroless plating (LIEP) process was recently developed and thoroughly demonstrated with one of the most used polymers for plating processes: acrylonitrile-butadiene-styrene (ABS). This generic process is based, thanks to the use of diazonium salts as precursors, on the covalent grafting of a thin layer of poly(acrylic acid) (PAA) acting as ligand for metallic salts onto pristine polymer surfaces. This strategy takes advantage of the PAA ion exchange properties. Indeed, carboxylate groups contained in PAA allow one to complex copper ions which are eventually reduced and used as catalysts of the metallic deposition. Essentially based on ABS, ABS-PC (ABS-polycarbonate) and PA (polyamide) substrates, the present paper focuses on the role of the polymer substrate and the relationships between the macroscopic properties and microscopic characterizations such as infrared (IR), X-ray photoelectron spectroscopy (XPS), atomic force microscopy (AFM), and scanning electron microscopy (SEM). The adhesion strength of the metallic layer deposited via that LIEP process with the bulk polymer substrates was successfully compared with the adhesion of similar copper films deposited by the usual process based on chromic acid etching and palladium-based seed layer, by measuring the T-peel adhesion strength, and by carrying out the common industrial scotch tape test. Lastly, the electrical properties of the deposited layer were studied thanks to a four-point probe and scanning tunneling microscopy (STM) measurements