| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Palacin, Serge
Direction de la Recherche Technologique
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (26/26 displayed)
- 2017Hybrid metal-polymer nanoparticles as promising radiosensitizers for cancer treatment
- 2016Pulse potential deposition of thick polyvinylpyridine-like film on the surface of titanium nitridecitations
- 2014VUV grafting process: An efficient tool for 3D bulk patterning of polymer sheetscitations
- 2013A H2-evolving photocathode based on direct sensitization of MoS3 with an organic photovoltaic cellcitations
- 2013Polymer grafting by inkjet printing: a direct chemical writing toolsetcitations
- 2012Towards organic film passivation of germanium wafers using diazonium salts: mechanism and ambient stabilitycitations
- 2011Localized Ligand Induced Electroless Plating (LIEP) Process for the fabrication of copper patterns onto flexible polymer substratescitations
- 2011Polystyrene Tribological Performance: Progress in the Understanding of Polymers Attrition during Chemical Engineering Processes
- 20113D-amino-induced electroless plating process: a powerful toolset for localized metallization onto polymers substratescitations
- 2010Microscopic study of a ligand-induced electroless plating process onto polymerscitations
- 2010ABS Polymer Electroless Plating through a One-Step Poly(acrylic acid) Covalent Graftingcitations
- 2009Low-temperature growth of nano-structured silicon thin films on ITO initiated by metal catalysts
- 2009Electrochemical-switchable polymer film: an emerging technique for treatment of metal ion waste watercitations
- 2009Selective electroless copper deposition on self-assembled dithiol monolayerscitations
- 2009Electrochemical behavior of polyacrylic acid coated gold electrodes: an application to remove heavy metal ions from wastewatercitations
- 2009Surface Electroinitiated Emulsion Polymerization (SEEP): A mechanistic approachcitations
- 2009On the structure-property relationship of the AMV anion-exchange membranecitations
- 2008Conducting and lubricating nanocomposites thin films based on carbon nanotubes and fluorinated poly(methacrylate)
- 2008Grafting organic polymer films on surfaces of carbon nanotubes by surface electroinitiated emulsion polymerizationcitations
- 2008Investigation of the mechanical and electrical properties of nanocomposite thin films by conducting probe AFM
- 2007Hybrid solar cells based on thin-film silicon and P3HTcitations
- 2007Carbon nanotubes/fluorinated polymers nanocomposite thin films for electrical contacts lubricationcitations
- 2007Grafting Polymers on Surfaces: A New Powerful and Versatile Diazonium Salt-Based One-Step Process in Aqueous Mediacitations
- 2006New concept to remove heavy metals from liquid waste based on electrochemical ph-switchable immobilised ligands.citations
- 2006Tetrathiafulvalene-based podands bearing one or two thiol functions : Immobilization as self-assembled monolayers or polymer films, and recognition properties.citations
- 2006Carbon nanotubes/fluorinated polymers nanocomposite thin films for electrical contacts lubrication
Places of action
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article
Microscopic study of a ligand-induced electroless plating process onto polymers
Abstract
The ligand induced electroless plating (LIEP) process was recently developed and thoroughly demonstrated with one of the most used polymers for plating processes: acrylonitrile-butadiene-styrene (ABS). This generic process is based, thanks to the use of diazonium salts as precursors, on the covalent grafting of a thin layer of poly(acrylic acid) (PAA) acting as ligand for metallic salts onto pristine polymer surfaces. This strategy takes advantage of the PAA ion exchange properties. Indeed, carboxylate groups contained in PAA allow one to complex copper ions which are eventually reduced and used as catalysts of the metallic deposition. Essentially based on ABS, ABS-PC (ABS-polycarbonate) and PA (polyamide) substrates, the present paper focuses on the role of the polymer substrate and the relationships between the macroscopic properties and microscopic characterizations such as infrared (IR), X-ray photoelectron spectroscopy (XPS), atomic force microscopy (AFM), and scanning electron microscopy (SEM). The adhesion strength of the metallic layer deposited via that LIEP process with the bulk polymer substrates was successfully compared with the adhesion of similar copper films deposited by the usual process based on chromic acid etching and palladium-based seed layer, by measuring the T-peel adhesion strength, and by carrying out the common industrial scotch tape test. Lastly, the electrical properties of the deposited layer were studied thanks to a four-point probe and scanning tunneling microscopy (STM) measurements